Electronics Forum | Thu Jun 22 11:36:02 EDT 2006 | mumtaz
Yesa yes Samir - you are stupid to form any other opinion but davefs! You should always follow his advice. Maybe you Samir, need to talk to your engineers for further advise.
Electronics Forum | Thu Jun 22 15:49:53 EDT 2006 | samir
Shocker, You truly live up to your name with those "sexist" remarks! Are you Islamic? "Mumtaz" is an Indian/Arab name. As for me, my wife converted me to become non-muslim...probably the non-practicing muslim here in Riyadh...
Electronics Forum | Tue Jun 20 17:19:43 EDT 2006 | chrisgriffin
Yeah, and I would love to see a data sheet on the great Bahodium solder and the "Advanced Heat Radiation and Gasification". I'll stick with my so-called "reflow" process.
Electronics Forum | Wed Jun 21 13:51:36 EDT 2006 | chrisgriffin
I would go with a 7-zone oven. A 5-zone oven would get you by, but for a little more you could get a 7-zone that will handle a more challenging reflow process as will as more volume.
Electronics Forum | Wed Jun 21 07:48:17 EDT 2006 | emeto
Hello all, Can anyone explain me time/pressure dispensing. How does the process flow step by step. All details are important. Please help. Thank you!
Electronics Forum | Mon Jun 26 17:51:17 EDT 2006 | russ
Just don't see it happening Bolos, aint gonoing to make up 3 bucks with BGA vs. QFP. Both packages from an assembly standpoint should be equal dollars. Why do you want BGA over QFP? Is it because you think your process will be better with BGA? Ru
Electronics Forum | Fri Jul 07 04:18:48 EDT 2006 | Rob
Hi Pavel, We tried 6 or 7 but they all had issues with one part or another of their process. The only consistantly good ones we experienced were the Japanese manufacturers Nitto & Fujikura - these were more expensive than the other options, but pro
Electronics Forum | Wed Jun 28 10:09:49 EDT 2006 | pms
We use CircuitCam for our MyData programming and floor documentation. It's great. Get CAD data from your customers and it will speed up the whole CircuitCam process 500 % (as long as you have the correct CAD importer for the CircuitCam program).
Electronics Forum | Wed Jul 05 07:44:36 EDT 2006 | davef
IVF Research Publication - "Cleanliness and Reliability: Evaluation of Test Methods and the Impact of Contamination from the Production Process on the Reliability of Printed Circuit Board Assemblies"
Electronics Forum | Tue Jul 18 03:04:46 EDT 2006 | sharifudin
We are trying to reduce the number of unit fail at QA Visual Inspection due to Solder On Gold Finger. We know so far that the solder is spattering onto the Gold Finger during reflow. I need some advise on what kind of process can improve to reduce th
