Electronics Forum | Fri Aug 07 10:14:43 EDT 1998 | RWW
| I'm currently running a double sided paste smt board loaded with 0603's, on the secondary side. Many of the 0603 devices tombstone during reflow if the parts are not perfectly centered on the pads. Is this caused by the .008 foil thickness? Has any
Electronics Forum | Mon Oct 19 17:43:12 EDT 1998 | John Gregory
Ryan - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Mon Oct 19 17:45:25 EDT 1998 | John Gregory
Dave - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Sun Jul 26 20:54:40 EDT 1998 | Masdi Muhammad
Hi, Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subjecte
Electronics Forum | Mon Jul 27 08:42:13 EDT 1998 | Justin Medernach
| Hi, good friends | I found this site is so wonderful to learn SMT techniques meaningfully. | We now employ 3 Fuji GL-541 dispensors and raw material with Soma IR-120. but we found glue string casually. From my experience from trouble-shooting the c
Electronics Forum | Wed Jun 24 16:30:37 EDT 1998 | Justin Medernach
Hi all, I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process terminolog
Electronics Forum | Wed Jun 24 20:06:42 EDT 1998 | Dave F
| Hi all, | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process termin
Electronics Forum | Fri Jun 26 09:01:25 EDT 1998 | Justin Medernach
| | Hi all, | | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process te
Electronics Forum | Wed Jun 24 17:41:46 EDT 1998 | Wayne
| Hi all, | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process termin
Electronics Forum | Tue Jun 16 22:26:04 EDT 1998 | Dave F
| The company I work for has only 1 SMT line all FUJI 89 vintage, My expierience with the Industry started with this line when it was brought into the company 2 years ago, from day one I've been the Process tech for the line and have learned a great
