Electronics Forum | Mon Jun 30 22:02:43 EDT 2003 | davef
If you don't seal your packaging, the silica gel will try to remove the moisture from the air and will become saturated pretty quickly. There is no requirement that you pack/ship with dessicants. Some customers require such things though. Why do y
Electronics Forum | Wed Jul 02 03:12:31 EDT 2003 | Joanna
We have been having problems with solder paste balls around fine pitch ICs and have decided that cleaning the boards in an ultra sonic cleaner may reomove these solder balls. However we are worried that the ultrasonic cleaning process may damage the
Electronics Forum | Thu Jul 03 08:40:23 EDT 2003 | Kris
Hi, undercured solder resists may be a defect people have seen so far. Some of the probles arising is blistering as well as reaction with wave solder flux that may lead to some kind bad gel like formations. Gels the idea would be to reflow the ba
Electronics Forum | Wed Jul 09 19:05:06 EDT 2003 | randywomack
LOZ. Under-cured or out-of-spec(sloppily) applied resist is realistic. What other physics: Shiny resist surface is more prone to balls then matte finish. How about an operator eating fish & chips before handling the boards. Don't laugh... ... saw th
Electronics Forum | Tue Jul 15 16:31:11 EDT 2003 | GerberGrab
If you just need gerber to placement list processing, then you might be interested in GerberGrab. It's not as sophisticated as the more expensive packages that include this capability, but it's getting better all the time and it's much more affordabl
Electronics Forum | Tue Jul 29 09:28:24 EDT 2003 | russ
Why would you get black pad from rework? I could be wrong but once the pad has accepted solder from the first reflow process wouldn't that eliminate the possibility of a latent finish defect? I am curious. We do perform rework on ENIG all of the tim
Electronics Forum | Wed Jul 30 00:05:05 EDT 2003 | praveen
Hi, I am observing warpage in the PBGA during reflow in rework machine.Reflow profile is std. (Peak temp is 214 deg C using 63/37 paste). Please advise what should be the gap between the nozzle and the BGA body during reflow process in SRT BGA rework
Electronics Forum | Mon Aug 04 17:35:08 EDT 2003 | Dean
If you lay a flat edge on the PBGA, it is visibly warped? How much of a warp? 0.001, 0.010, 0.050 what? What is your pcb temperature just prior to entering the spike process (zone or step or what ever you call it)? Is it between 165 and 175 C?
Electronics Forum | Fri Aug 08 11:44:44 EDT 2003 | Henry
I am fairly new to wave soldering and production processes, but I have been tasked with coming up with a calculation involving the shear strength of some through-hole leads. The leads are tinned copper and I suspect that tinning reduces the shear st
Electronics Forum | Fri Aug 15 01:31:17 EDT 2003 | Jay
Hi All, I work for a contract manufacturing and we are having a new PCB to build. The PCB has OSP coating on it and it has been sitting open in the production floor for about 15 days. I am not sure weather it will affect the soldering process or not
