Electronics Forum: process (Page 541 of 1146)

Yamaha YV100 Feeders

Electronics Forum | Mon Sep 11 10:35:32 EDT 2006 | Gus Widmayer

Hi Dexter, Your problem may not be with the feeder itself but with the quality of the tape you are receiving. OX3 Corporation performs a peel test on every single line item that is processed through its facility. You may want to check with your cu

Non wetting on fine pitch product

Electronics Forum | Thu Sep 07 07:41:06 EDT 2006 | Bubba

Check for coplaner leads if this just exists at reflow process, i.e. look at part before oven, turn on 3D at placement machine. If you see after wave solder, the wave could cause coplanarity issues on top as well if you are going slow enough to refl

Companent storage time before soldering

Electronics Forum | Tue Sep 12 01:50:22 EDT 2006 | meritajs

Hi All, We find out that some companents in leed free reflow soldering process have bad wetting and soldering This soldering problems caused by companent storage time after shipment Could somebody inform us about maximum storage time for different c

Companent storage time before soldering

Electronics Forum | Tue Sep 12 19:36:17 EDT 2006 | davef

We've been soldering leadfree components for maybe 15 years. We'd be surprised not to be able to store components for at least a year, not that we purposely do that. Component fabricator process determine the maximum storage time for components. M

Fine pitch wave soldering

Electronics Forum | Fri Sep 15 12:30:05 EDT 2006 | Steve

If the package is robust enough to handle surface mount followed by a pass through the wave soldering process, we have had excellent results populating the fine pitch parts with the P&P machine, reflow, then mask the solder joints prior to wave solde

SMT Edge Connectors

Electronics Forum | Fri Sep 15 15:57:34 EDT 2006 | Steve

What kind of connector is it? How does the manufacturer recommend processing their part? We've had quite a bit of experience using Tyco 'Mictor' connectors, with their inserter. We paste both sides of the board then drop the board on the inserter. A

PCB Assy Cleaning

Electronics Forum | Mon Oct 02 06:41:53 EDT 2006 | saaitk

We have a customer enquiry that requires PCB assemblies to be cleaned to J-STD-001 / -004 class 3. We use both water based and no clean process chemistries. No clean flux residues are not permitted and would therefore have to be cleaned. My question

SAC solder balls reflow with Sn/Pb paste - Voids Issue

Electronics Forum | Tue Oct 17 09:27:23 EDT 2006 | SWAG

We had a build that showed a relatively high occurence of BGA voids like you were seeing. It was a very small volume first article that took a long time to get through the line so the paste sat on the boards too long. As we ramped up TACT time in p

Contaminants after SMT which affect wire bonding

Electronics Forum | Fri Oct 06 04:23:06 EDT 2006 | David

What is the solder finish of the board?. If this is gold, maybe you should check the reflow profile and max temperature which can easely kill your gold coating so problems with bonding. Also we are using Prozone Multicore with ultrasonic to clean

OSP

Electronics Forum | Mon Oct 09 10:58:26 EDT 2006 | Matt Smith

Over the past several months we have experienced intermittent problems with wave solder voids on PCBs coated with OSP. We suspect variation in the OSP application process, or oxidation of the surface due to insufficient or degraded OSP. Is there a me


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