Electronics Forum: process (Page 606 of 1146)

Re: via hole plugging

Electronics Forum | Wed May 19 13:13:20 EDT 1999 | Dave F

| We care currently running into problems during our plug via process: | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is

Re: Printing Adhesive

Electronics Forum | Wed May 05 14:24:24 EDT 1999 | Mark Lessig

Hello Kevin, I work for a leading manufacturer of paste and adhesives and have alot of experience with printing smt adhesives. We also have publications that can lead you to better understand the process. Printing of adhesives are as easy as printing

Re: Printing Adhesive

Electronics Forum | Thu May 06 09:17:30 EDT 1999 | Sokkhon Ou

| Hello Kevin, I work for a leading manufacturer of paste and adhesives and have alot of experience with printing smt adhesives. We also have publications that can lead you to better understand the process. | Printing of adhesives are as easy as prin

Re: Printing Adhesive

Electronics Forum | Fri May 07 12:58:31 EDT 1999 | John Staley

| Kevin, I also work for a major adhesive manufacturer and would be pleased to send you several technical papers and some basic equipment settings for printing adhesives. If you will leave you name and mailing address on my voice mail (800)323-6106

Re: Hot Air Nife

Electronics Forum | Wed Apr 28 15:23:11 EDT 1999 | JohnW

| | Anyone using hot air nife for wave soldering process. | | Does it work? | | Does it really eliminate solder bridging and does it create any other problems? | | | | any feed back will be much appriciated. | | | | Thanks | | | | Tony A | | |

Re: Successful Transfers to Contract Manufacturers

Electronics Forum | Wed Apr 28 08:04:26 EDT 1999 | Dave F

| | Thank for the input. But I guess I was looking for more. We have been transferring boards for some time and a have good working relationship with our primary CEM and have worked out many bugs. I was thinking more on the order and don't shoot m

Re: Delamination

Electronics Forum | Tue Apr 27 17:22:40 EDT 1999 | Dave F

| Board Experts | | I am fighting with a board house about a delamination problem.. First the facts | 1) 10 layer board .063 thick HASL Finish Aprox 16 in x 17 in. | 2) 150 Boards with this part number built with the same reflow oven settings (2

Re: AOI

Electronics Forum | Thu Apr 15 16:27:33 EDT 1999 | Nancy V

I had someone suggest that they weren't really necessary as long as your process is good. Is this just a way to help you keep an eye on your process? I was thinking, as we set up our line, our money would be more well spent with controlling the pro

Re: AR vs. UR

Electronics Forum | Thu Mar 25 19:19:08 EST 1999 | Graham Naisbitt

| I am looking into replacing another business division's Acrylic coating process with our Urethane coating process. Unfortunately, MIL-I-46068 doesn't differentiate AR/UR's performance, and the MFR data sheets don't match up at all (they each spec

Re: AR vs. UR

Electronics Forum | Fri Mar 26 13:02:18 EST 1999 | Scott McKee

Sorry, in the following message I'm agreeing with Graham - not Greg... | | I am looking into replacing another business division's Acrylic coating process with our Urethane coating process. Unfortunately, MIL-I-46068 doesn't differentiate AR/UR's p


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