Electronics Forum | Thu Apr 13 05:13:22 EDT 2000 | C.Long
Anyone have any ideas as how to track the amount of air exposure to SRAMS etc as thay move from stores onto the production floor. i am looking for ideas as how to track the exposure time from the time they are taken out of ther packaging to the time
Electronics Forum | Thu Apr 13 10:01:54 EDT 2000 | Wolfgang Busko
Hi: Use the whip on your operators.!!! Serious: The assembly should know how much time they have left to process those parts safely. Keep them as long as possible in the drybags, reclose the bags immediately after getting the needed parts out. In t
Electronics Forum | Wed Apr 12 21:43:56 EDT 2000 | Micah Newcomb
Is this board going across wave? If not, you are pretty safe to lose the glue process. If it does go across wave you can probably lose the solderpaste and replace your solder stencil with a glue stencil, much faster and efficient than dispensing.
Electronics Forum | Tue Apr 11 17:45:02 EDT 2000 | Ashok Dhawan
I am looking for an appropriate method to dry wave soldered boards. While board assemblies are passed through board cleaning station , they are not fully dry . We do not want to heat above 180 deg F to dry them completely. We think that air drying u
Electronics Forum | Tue Apr 04 07:46:03 EDT 2000 | Donnie
Neil, We currently use only visual inspection with a magnified lamp and actually brush the board after the wave process to help knock off any solder balls. You wanna use an ESD sensitive brush material. Camel hair is what we use. It works real wel
Electronics Forum | Tue Apr 04 10:18:58 EDT 2000 | Russ
Brian, I agree with Jesper, You seem to have a PCB supplier problem! The conditions that you are processing your assembly with are nothing unusual and in fact very standard throughout all of the manufacturing facilities that I have been in, unless
Electronics Forum | Wed Mar 29 09:39:45 EST 2000 | JAX
Garo, Minor voiding in Ball Grid Array solder joints is common, and not considered a threat to reliability. The biggest cause of open solder joints caused by voids is the outgassing of moisture. They are formed when pockets of gas are trapped durin
Electronics Forum | Fri Mar 24 13:02:53 EST 2000 | Ashok Dhawan
Two questions on ESD: 1. What is recommended method ( Air ionizer , grounding strip etc. ) for a board prep ? We Kapton Tape for masking pads or not to be soldered areas. or Is there a wet mask recommended for masking boards campatible with NC Sold
Electronics Forum | Fri Mar 24 03:06:35 EST 2000 | Sal
guys Using a well estrablished water soluble solder paste, but having problems with tack time. Data sheet recommend a couple of hours but we are seeing problems after about 15 minutes with 0402/0603 componenets bouncing off. The printer environment
Electronics Forum | Mon Mar 20 20:22:47 EST 2000 | Dreamsniper
We used to have our PLCC,s, TSOP's and QFP's (0.65 mm pitch) Land Patterns designed in square corners. Some of our products have them designed in Full Radius Corners. As of now, with the two different designs running in our production floor, we can't
