Electronics Forum: process (Page 691 of 1146)

Contamination/process issues of SMT and wave soldered pcb's

Electronics Forum | Thu Jul 03 07:53:57 EDT 2003 | davef

That has to be the worst of all worlds. Someone goes out and buys the cheapest parts they can find, gives them to you [Loz], and wants you to assemble a perfect product. Well, it would be nice if you could console yourself by making Derick Jetter m

Contamination/process issues of SMT and wave soldered pcb's

Electronics Forum | Thu Jul 03 18:14:03 EDT 2003 | russ

Kris, I don't know what I HAVEN'T SEEN yet cuz I haven't seen it. (HAHAHA) It is kind of like when you are looking for something and you always say after you found it that it was the last place you looked (Why would anyone keep looking for something

Soldering FBGA Virtex-II XC2V6000-4FF1152C

Electronics Forum | Thu Jul 10 15:00:58 EDT 2003 | russ

Louis, For whatever it is worth, When I have $5000 parts I don't even mess around with a rework station. I would mask off any heat sensitive components (We use water soluble masking like that for wave soldering) and then process through the oven yo

Flex circuit assembly

Electronics Forum | Thu Jul 17 09:26:28 EDT 2003 | Mike J

Mike: We have provided many carriers for flex circuit applications to facilitate processing through screen print, pick-and-place and reflow and, in many cases, eliminating the need for taping the flex circuit to the carrier. Please contact me and w

solder fillet peeling update....

Electronics Forum | Mon Jul 14 16:26:58 EDT 2003 | slthomas

Yes, they do the cleaning, we did the (apparently first) inspection and caught the problems. They tried a shorter cleaning cycle, witnessed no defects, and attributed the defects on the boards we had to their cleaning process. Now they just plan on

Pinhole Solder Joint Reliability

Electronics Forum | Tue Jul 22 06:41:40 EDT 2003 | davef

bga void doe * Dr. Lee at Indium Corp. has conducted a number of investigations concerning solder joint voiding and BGA components. Check Indium's site. [As an aside, Lee's book "Reflow Soldering Processing and Troubleshooting SMT, BGA, CSP and Flip

CLEANING OXIDIZATION OFF OF WHITE TIN PADS

Electronics Forum | Thu Jul 17 16:07:23 EDT 2003 | davef

So, how do you know it's "oxidation"? If the parts didn't solder, why aren't the parts the problem? Do the parts take-on solder? Please describe: * Appearance of the post-solder components. * Scope and extent of the problem. * Appearance of the po

Bga replacement on ENIG Fabs.

Electronics Forum | Tue Jul 29 09:47:40 EDT 2003 | davef

We agree with Russ and Ioan that rework does not cause black pad. It's caused during the board fabrication process. On the other hand, we think: * Mantis wants to reduce the amount of reworking of boards that fail due to a black pad problem. *

SRT -1000 BGA rework system

Electronics Forum | Wed Jul 30 22:37:15 EDT 2003 | Dean

I have been using a srt-1000 since 98. My guess is your heating up the part too fast. What is your heating rate (deg. C per second)? PBGA's do warp. Your profile should mimic your smt process (assuming you have no warping there). Also, check wit

Glass Plate for machine Calibration

Electronics Forum | Wed Aug 20 17:25:02 EDT 2003 | Dean

Coincidence? I just finished a glass calibration this morning on a P&P machine. Excellent tool for precision calibration. Takes the guess work out of the process. I would disagree with Cal's assessment. His calibration methods may work to suit h


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