Electronics Forum: process (Page 711 of 1146)

GSM-1 Board handling.

Electronics Forum | Wed Aug 10 11:57:41 EDT 2005 | jh0n!

I recently picked up a used GSM-1, 1994 or 1995 vintage. I'm in the process of setting up my first product on it - everything seems to be going well, however there's a constant inch or so offset on the X-axis. That is, when the board slides in, it'

Solder Wave

Electronics Forum | Thu Aug 11 13:09:11 EDT 2005 | bman

In addition to Pete's fine tips, here's one we have successfully used in similar situations as long as you're using OA flux. Get some kind of pump action spray bottle (like hair spray comes in) and fill is with some of your wave flux. Use the bottl

White Residues

Electronics Forum | Tue Aug 16 11:27:14 EDT 2005 | saragorcos

Hi Peter, I posted these links to Technet as well, but figured I would add them here as well in case any of the smtnet readers would like to see them. Here are some links to some articles about white residue sources, and whether or not white residue

Brd(Electroylic Gold finishing) got blisters

Electronics Forum | Wed Aug 24 08:50:59 EDT 2005 | davef

First, while black pad can be a problem with poorly controlled electroless gold [search SMTnet Archives for background], it is not a suffiecient reason to use electrolytic. It's the reason the supplier should fix their electroless gold process. Se

REFLOW PROFILE NEED HELP

Electronics Forum | Wed Aug 24 08:46:10 EDT 2005 | aj

James, I understand that you would like a quick fix answer but profiles take time and analysis to get right. Firstly, your paste supplier should provide an example of the correct profile for the paste you are using. Secondly, what makes you think

Immersion gold and BGAs

Electronics Forum | Fri Aug 26 09:57:21 EDT 2005 | russ

The Immersion gold is not a problem with BGAs specifically but "black pad" which can be present anywhere. The unfortunate thing with BGAs is you cannot see it. Personally I hate white tin. It is okay for single sided boards running no-clean, but c

Solder balls under LLP

Electronics Forum | Mon Aug 29 11:05:10 EDT 2005 | foresiteeric

davef: I am a colleague of Sara at Foresite and we came to the conclusion that the solder balls were entrapped based on the minimal amount of information from the original question and the fact that the x-ray showed the balls and it wasn't mentioned

Water Soluble Paste

Electronics Forum | Tue Aug 30 07:01:52 EDT 2005 | edgetech

EdgeTech SMT Tech here. I was questioning the process our Engineers are using concerning Water Soluble solder paste. I have no experience with this paste. I was wondering what need so be done differently when using this paste. As far as I know the on

Dry and Clean Room in Tropical Climate

Electronics Forum | Sun Sep 04 01:59:41 EDT 2005 | smartasp

We need to dry and clean the air in our dedicated poting and conformal coating room. Can anybody help on how to go about it. The airconditions only recycle and dry until room temperature is reached and therefore have great fluctuations and unstable p

Scrap criteria

Electronics Forum | Tue Sep 20 10:32:25 EDT 2005 | slthomas

I would say it depends on the process requirements for the board and the reliability requirements as has already been mentioned. If you do two-sided reflow you might allow for fewer rework attempts, for example. If it's a medical device you might on


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