Electronics Forum | Thu Oct 15 16:41:28 EDT 1998 | Dave F
| | All Y'll | | | | How do you clean components that must be added to an assembled board after water wash? | | | | BACKGROUND | | | | Our basic process goes like this: | | | | 1 Print paste with OA flux, place, reflow, wash | | 2 Repeat 1 | |
Electronics Forum | Sat Oct 17 10:50:11 EDT 1998 | mike
| | | All Y'll | | | | | | How do you clean components that must be added to an assembled board after water wash? | | | | | | BACKGROUND | | | | | | Our basic process goes like this: | | | | | | 1 Print paste with OA flux, place, reflow, wash |
Electronics Forum | Thu Oct 01 16:46:50 EDT 1998 | Dave F
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Tue Sep 29 04:54:23 EDT 1998 | Clive Heke
Thank you Steve for your input it was very usefull. I think I skipped a few pertinant details on my initial message though, the component which we found the flux contamination on was on the top side of the board, I was curious if the flux could come
Electronics Forum | Thu Sep 17 12:08:13 EDT 1998 | Graham Naisbitt
Wayne, I think Dave and Justin are correct but I would just add my twopennworth: Your customer presumably wants to know if the end-product will be reliable? If he/she wants you to prove cleanliness, ask them for the spec they want to work to and app
Electronics Forum | Tue Sep 15 16:40:01 EDT 1998 | Ben Salisbury
| | Dynapace now has many styles of PCB conveyors in stock for quick delivery. Also available for quick delivery are bare board loaders along with other modules for automating your process. | Sorry Vendor Person, | You should have gotten on the capit
Electronics Forum | Mon Sep 14 07:19:34 EDT 1998 | Wayne Bracy
DB Sure, it is always possible to "duck in outside air" to use with production equipment, but be careful, you have to determine the air quality required for your process. Cosnsider moisture, contaminates and the actual forcing of air into a confine
Electronics Forum | Fri Sep 11 17:23:00 EDT 1998 | Eric Miller
Hey Dave, sounds like your material is delaminating at a rapid rate, I would not recommend using them through your process, delaminating material has to go some where! When composite material is made, layers of fibre glass and epoxy resin are placed
Electronics Forum | Mon Sep 14 09:25:49 EDT 1998 | Dave F
0.050" -> 50 mil -> 50 pitch | 0.80 mm -> 0.032" -> 32 mil -> 32 pitch | 0.64 mm -> 0.025" -> 25 mil -> 25 pitch | 0.50 mm -> 0.020" -> 20 mil -> 20 pitch | 0.40 mm -> 0.016" -> 16 mil -> 16 pitch | 0.20 mm -> 0.012" -> 12 mil -> 12 pitch | Dave F Y
Electronics Forum | Tue Sep 08 15:11:26 EDT 1998 | Mike Demos
Rich: In my experience, I have seen three cases of SMT Capacitors cracking: 1. Due to thermal shock when entering the wave solder. Note that these were 1210 package sizes on the wave solder side of the boards. We were able to trace this back to th
