Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
Electronics Forum | Wed Mar 01 17:03:56 EST 2000 | Dave F
Steve: Someone is trying to trick you. He/she is trying to be very smart, but he/she didn�t anticipate this "dark haze" coating problem. I suspect that this person is someone you speak with every day in your plant. They may be the one that came-u
Electronics Forum | Fri Mar 10 12:12:55 EST 2000 | Russ
Casey, I will start with the lack of thermo-couple control - The unit I have is based on time and temp. exclusively. What happens when a cold board gets reworked vs. a hot board? No bottom side preheat, the heating is very localized to topside a
Electronics Forum | Fri Mar 03 10:20:12 EST 2000 | se
Steve, I'd stop worrying about the in-line feature of the printer, I've never really seen an in-line system that wasn't capable of batch operation and there will be very little, if any, cost saving associated with going batch load only. An in-line m
Electronics Forum | Thu Feb 17 11:38:53 EST 2000 | Steve Thomas
We appear to have solved a major reflow process problem (poor quality joints on a 20 mil QFP100...excessive solder left on the lead leg, not much left for a joint) with a design change to the board. We gave ourselves considerably more room for a hee
Electronics Forum | Wed Feb 16 15:29:15 EST 2000 | John S.
My company manufactures electronic modules for the automotive industry. We have a current product that the customer would like a "heavy duty" version of. The module will have to handle roughly twice as much power as the original. A couple of compo
Electronics Forum | Mon Jan 15 11:45:39 EST 2001 | bdoyle
Hi guys, thanks for the feedback! Wolfgang - we're looking into making this forum similar to the old one (displaying messages instead of just threads on the forum homepage). In the meantime have you checked out the feature "While You Were Out" whic
Electronics Forum | Tue Jan 16 18:00:50 EST 2001 | mikestringer
Hi everyone I am in the process of reviewing our storage of SMT components. At the moment they are pretty much on open shelves in the factory environment. We endevour to reseal components labled 'moisture sensitive' in their original packaging, bu
Electronics Forum | Tue Jan 23 20:53:51 EST 2001 | davef
Sorry, not much help for me there. More information would be helpful. For instance: * Talk about the distribution of the problem, including a single lot or from various lots and over components and component types on the board * Tell us about the boa
Electronics Forum | Tue Jan 23 10:57:54 EST 2001 | mdaley
Hello, I'm currently in the process of determining the best way to place bare die (flip chip) on our substrates. I've seen the Hover-Davis DDF and was impressed by it's capabilities. I particularly like the fact that I won't incur the cost of packa
