Electronics Forum: process (Page 851 of 1146)

Re: Metal Inspection Templates

Electronics Forum | Tue Sep 21 15:31:05 EDT 1999 | Hugh Martin

| | | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | | | Thank you.

water soluable or no clean flux?

Electronics Forum | Mon Sep 20 08:21:52 EDT 1999 | Mohammed saad

Hi all, We have a little discussion here about the suitable flux for a certain process, as all of us are beginners we need your advice. We are producing VGA cards and mother boards for PC's all components to be wave soldered are TH, the SMD is done

Re: reflowing double sided SMT

Electronics Forum | Thu Sep 23 06:01:16 EDT 1999 | joel cruz

| | I'm looking for some good articles on reflowing of double sided SMT boards. I'd like to come up with a process for low volume prototyping, but need to understand the do's and don'ts. | | | Hello, | you can get some insight by typing in double s

Re: reflowing double sided SMT

Electronics Forum | Thu Sep 23 06:06:20 EDT 1999 | joel cruz

| | I'm looking for some good articles on reflowing of double sided SMT boards. I'd like to come up with a process for low volume prototyping, but need to understand the do's and don'ts. | | | Hello, | you can get some insight by typing in double s

Re: Missing SMT Chip Components

Electronics Forum | Mon Sep 13 12:31:41 EDT 1999 | Wolfgang Busko

| Hi, | | Recently encountered missing components problem at the SMT process. | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. Checked t

Re: PCB Component Legend Under SMT Pad/Land

Electronics Forum | Mon Sep 13 04:17:10 EDT 1999 | Earl Moon

| I noticed that some of our pcb's component legend/designation are unreadable as they are placed under smt pads. Is this correct and according to standard? Although we don't have any problems with them as of now, I would like to know the effects on

Time to use alternative finishing ???

Electronics Forum | Fri Sep 10 13:50:24 EDT 1999 | Jose RG

We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with o

Re: Time to use alternative finishing ???

Electronics Forum | Fri Sep 10 14:29:48 EDT 1999 | Doug Philbrick

| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with

Programming with F4G

Electronics Forum | Sat Sep 04 06:37:46 EDT 1999 | JC Leigh

Dear all, I don't know if I'm asking at the right place here, since you all seem to be more focused on process problems then programming problems (or perhaps programming isn't a problem for you). I'm using FUJI CP642's and I've got some components

Re: SiPlace Rotary Star Heads

Electronics Forum | Thu Sep 02 08:45:51 EDT 1999 | Jason Gregory

| To all SiPlace Users, | | I know there are lots of you out there! From your own experiences, what sort of life expectancy would you expect (in terms of number of placements) from a rotary star head for a Siplace 80S15 or 80S20 machine, before a re


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