Electronics Forum: process (Page 891 of 1146)

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Sat Mar 08 21:31:17 EST 2003 | MA/NY DDave

Hi Yes DavidF I agree, and that is what I think I am reading in the orginal and follow on post from the poster. I think this problem is just below full failure to solder which was your point, I think. You, and I particularly, are taking opposing y

Tact Time Estimates

Electronics Forum | Mon Mar 10 10:17:15 EST 2003 | gregp

Tact time as defined by the IPC 9850 standard is "the average time required to place a single component while maintaining the specified placement process capability. Excludes transfer time, fiducial time and nozzle change time." Sounds like what you

Tact Time Estimates

Electronics Forum | Mon Mar 10 14:52:10 EST 2003 | MA/NY DDave

Hi You really received some good replies. It seems like the best replies are a BLOW to one of your engineers, at least from a terminology view point. "No cake tonight". Yet it doesn't mean (s)he is better or worse than the other. Tact Time from a

Scrapped Boards

Electronics Forum | Sun Mar 23 16:48:23 EST 2003 | MA/NY DDave

Hi "If a PCB board is scrapped because it contains faults that cannot be repaired or it has been damaged, we currently quarantine them for a period of time. Once this period of time has passed the boards are then disposed." Sounds Good, Usually thi

BGA attach eval.

Electronics Forum | Wed Apr 02 09:25:32 EST 2003 | davef

RDR The most common cause of dewetting is from a fabricator using any form of abrasive (e.g. pumice, abrasive brushes etc.) on copper. With this process, abrasive particles get implanted into the copper (often actually swaging copper over some of th

16 mil pitch QFPs / solder paste type 4 & 5?

Electronics Forum | Mon Apr 07 09:52:07 EDT 2003 | kmorris

I have just started an assembly which uses a 16 mil pitch QFP. We ran on Saturday, using a type 3 solder paste. (working Sat's really sucks) We really struggled with paste release after the stencil sat for 15 minutes without printing. Apertures clog

BGA Rework

Electronics Forum | Wed Apr 09 05:55:05 EDT 2003 | Chrissie

We've encountered a little problem with BGA's. There was a process problem in the build of the boards which has ment the BGA are failing open circuit due to the lack of solder paste. Any-one else had this problem? Any suggestions on solutions? We've

PCB layout with BGA

Electronics Forum | Fri Apr 11 09:36:55 EDT 2003 | davef

We don't know anything about using "old Tango for DOS". First, consider the fabricator of your part as the THE most appropriate place to look for layout recommendations. We've discussed the heirarchy of sources for layout information previously he

Solder paste softener

Electronics Forum | Sat Apr 19 10:45:43 EDT 2003 | Joe

Yngwie, In a previous life, I used a mixer made by Malcolm and was very happy with it. We used Alpha 609 WS paste and experienced no separation problems. The Malcolm equipment agitated the material in a non-concentric motion which tends to "fold

Agilis Feeders

Electronics Forum | Wed Apr 16 01:01:24 EDT 2003 | kenBliss

Pete Con Keeping the reels resident on the Agilis feeders is one of the key points of the feeder design. The critical points are to make changing feeders very quick less than 20 seconds per change out. You should have all your feeders on reels sta


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