Electronics Forum | Thu Apr 02 19:54:31 EDT 2009 | davef
CK The term that you're searching for is: "Singulation" the process of die punching circuit boards with a hydraullic press. [Although the very nice people that sell "saw depanelers" call their equipment singulators. We assume they do that because e
Electronics Forum | Wed Apr 22 11:58:16 EDT 2009 | markhoch
Quick Question! We have an assembly that we're building for a customer that will have to be soldered via a Lead-Free Wave Solder. We do not currently have a Lead-Free Wave Solder in house. Does anyone know of a company that may be able to provide thi
Electronics Forum | Tue Apr 28 08:51:35 EDT 2009 | davef
This is a snip from an ealier post here on SMTnet. Generally, solder pastes are comprised of: 90% solder powder, 5% flux, 4% solvents, and 1% activators [by weight]. Where: * Solder powder, when reflowed, is a metal bonding agent that mechanically
Electronics Forum | Tue May 12 01:09:17 EDT 2009 | malmsteen
Thanks for replying Mr BoardHOuse. The product has to be RohS compliance. Surface finished is something that I am still considering and currently looking at either OSP or Immesion Silver. In short whatever combination that can produce high reliabili
Electronics Forum | Tue May 12 10:03:12 EDT 2009 | daan_terstegge
Hi All, I see more and more components like QFN or LGA with bottom-only terminations,with landpatterns getting finer all the time. I have no ppm-figures of our process, but based on a benchmark study by Agilent I'd say that 500 ppm is a decent value
Electronics Forum | Tue Jul 14 18:42:41 EDT 2009 | anndi
1smtdude, I interested in your explaination of > re-work an underfill part. You mention the > material can be heated to a plastic state to > become vicious... do you know usually what range > is the temperate? (guess it can depend on the > type
Electronics Forum | Wed May 27 16:39:33 EDT 2009 | rmitchell
Hi, I think vision 20 will work as well. If not we have used 100 or 105. Have you tried placing the part with the machine trace on? If so is it finding all the leads? any error codes? If you are defining the leads in the EL lead data I would not d
Electronics Forum | Mon May 25 21:10:28 EDT 2009 | padawanlinuxero
Hello !! I have a problem with my wave solder oven, in one of the products we made has connectors on one side of the pcb and in the other one has SMT components the process is kinda tricky on the SMT components we use an adhesive and put to the refl
Electronics Forum | Wed Jun 17 16:02:09 EDT 2009 | mhunter
Any thoughts on this will be appreciated, thanks in advance for reviewing. This assembly has been processed in our facility by going through a press operation (~ 1731 lbs), then into wave solder. Note the discoloration around the pemnut. The discol
Electronics Forum | Fri Jun 19 07:28:56 EDT 2009 | mhunter
Thank you for your responses Davef and Boardhouse. The material used is Iteq Corporation IT-180. I performed more testing yesterday and found the following: I could insert Berg Pins into the assembly at various locations or a Pem. None of these