Electronics Forum: process capability (Page 1 of 70)

Print process capability

Electronics Forum | Mon Mar 03 08:16:00 EST 2003 | martys

We are using MPM and DEK printers, what are the critical variables for measuring print process capability?

Print process capability

Electronics Forum | Mon Mar 03 09:16:09 EST 2003 | msivigny

Hello martys, The critical variables to measure print process capability on any printer are its ability to securely clamp a board, accurately align the board to its mating stencil, print with appropriate squeegee pressure and follow print material gu

Wavesoldering capability study

Electronics Forum | Thu Jul 05 10:11:19 EDT 2007 | ck_the_flip

The variables to study: * Dwell Time * Contact Length * Conveyor Speed * Parallelism * Top-side Substrate Temperature Before wave * Solder Pot temperature All of these variables are inter-related (ie changing one variable will affect another)

Wavesoldering capability study

Electronics Forum | Tue Jul 10 11:49:20 EDT 2007 | samir

Parallelism tends to drift: �h After preventative maintenance �h From dross buildup or other obstruction clogging either wave Parallelism should at least be studied during the process characterization stage, so that you know your machine's process

Wavesoldering capability study

Electronics Forum | Thu Jul 05 21:46:53 EDT 2007 | davef

Here are the basics of determining that your process is in control and capable - http://lorien.ncl.ac.uk/ming/spc/spc9.htm There are tons of stuff like this on the web.

Wave solder capability study

Electronics Forum | Thu Jul 17 20:20:12 EDT 2008 | davef

Wave set-up DOE * Immersion depth [1/3 to 2/3 of board thickness] has the least impact of any variable in wave soldering. * Contact length the greatest impact. * Control flux density, time through preheaters, top side temperature as the board reaches

Placement equipment capability study ?

Electronics Forum | Wed Nov 21 11:30:48 EST 2007 | cyber_wolf

Has anyone been involved in SMT placement equipment capability studies? I was wondering if anyone has procured used equipment and performed capability studies on the equipment and received quality and cost benefits from the resulting data. They

intrusive reflow process

Electronics Forum | Tue May 28 13:25:57 EDT 2002 | zanolli

Hello Anthony, The amount of solder that the process is capable of applying is the biggest limitation. I believe that solder paste is only approx. 50% metal by volume. When connectors are soldered in intrusive reflow, often the stencil is "overprint

SMT process consultants

Electronics Forum | Mon Oct 15 10:53:21 EDT 2001 | Stefan

I would not mind some more business either. Although capable of installing all machine brands, I would like to restrict my expertise in the large vendor of German placement machines. stefwitt@netzero.net

BGA process requirements

Electronics Forum | Fri Apr 19 08:01:40 EDT 2002 | jnunns

We have been doing BGAs for about 3 years in house. We started off with an outside contractor and then brought it in. We are doing a variety of sizes from .05 to .03 pitch. We have 2D capability at print, but do not use it on any but the .03 pitch. T

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