Electronics Forum | Thu Oct 26 08:48:06 EDT 2000 | ptvianc
Of all of the process steps, paste printing is the most critical with respect to minimizing defects. Therefore, paste printing must be tightly controlled, particularly in the case of fine pitch (peripherally leaded) devices and BGAs. I believe that
Electronics Forum | Wed Oct 17 17:51:44 EDT 2001 | davef
This is a GREAT question!!!! Our process is similar, but our times are greater. Guess it's all dependant on the pressure on the pipe, eh? The faster money goes flying out the window, the less time there is for nicities.
Electronics Forum | Fri Jan 07 09:56:04 EST 2005 | davef
Electroformed stencil suppliers follow. The describe the stencil production process on their sites. * Aplpha Metals [ http://www.alphametals.com/products/ stencils/pdf/PG_Electroform_Stencils.pdf ] * Chepaume [ http://www.chepaume.com/electroforming
Electronics Forum | Fri Oct 14 09:58:13 EDT 2005 | patrickbruneel
Here's what I believe is happening. The main difference between the HASL boards and the gold plated boards is that HASL boards are pre-soldered. HASL boards need very little flux activity to get good hole fill and the machine settings have a wide pro
Electronics Forum | Mon Oct 09 07:48:49 EDT 2017 | swetalatwal
What is the meaning of process window
Electronics Forum | Wed May 21 08:16:57 EDT 2008 | tonyamenson
Good morning gentlemen, I could use some advise as to the min / max windows for the wave process. We have had little problems with our leaded wave but when applying the same process to lead-free wave we are having problems. Obvisouly the temps are
Electronics Forum | Tue Oct 10 13:30:20 EDT 2017 | charliedci
Here is a link to a reflow profile: http://www.aimsolder.com/sites/default/files/reflow_profile_supplement_-_lead-free_solder_paste.pdf Speaking specifically about solder reflow, the process window should be based on the solder paste you are using.
Electronics Forum | Wed Feb 04 16:21:51 EST 2009 | smtnet51
Hand solder it afterwards
Electronics Forum | Wed Feb 04 03:20:05 EST 2009 | smartasp
Hi All Reflow Gurus I have learnt that my process engineers do not consider the heat resistance, of the components when creating a reflow profile but rather try to stick to the paste recommendation. This has lead to a field recall as one component h
Electronics Forum | Wed Apr 08 22:39:12 EDT 2009 | jandon
AIM has very narrow process window on their solder pastes...
