Electronics Forum | Sat Aug 07 09:32:54 EDT 2010 | scotceltic
We have a Large LGA package (40mm X 40mm) that we are trying to process on a double-sided assembly. problem is the only space we have for it is on 1st side processing side. Therefore we have worries about falling off in the oven during the 2nd side
Electronics Forum | Mon Aug 09 08:16:44 EDT 2010 | markhoch
It will most likely hold on. There is a formula that you can use if you're uncertain. It's (weight of the component in grams)/(total pad mating area in square inches) Grams per square inch must be less than or equal to 35 for the component to be mo
Electronics Forum | Tue Nov 17 15:27:20 EST 1998 | Barry Kauffman
Can someone please tell me where I might find detailed information on the processing of a double-sided flex circuitry design. I am looking for specifics such as methods of fixturing,printing,placing and reflowing.Things to keep in mind when processin
Electronics Forum | Thu Nov 19 17:36:03 EST 1998 | Christopher Lampron
| Can someone please tell me where I might find detailed information on the processing of a double-sided flex circuitry design. I am looking for specifics such as methods of fixturing,printing,placing and reflowing.Things to keep in mind when process
Electronics Forum | Fri Apr 23 08:45:33 EDT 1999 | Steve LeCour
At Sanders (Military manufacturer), we have only started using plastic parts within the past few years. After being tasked with reviewing the new J-Std-033, it became obvious to me our process for controlling device exposure is weak. We build very lo
Electronics Forum | Tue Sep 01 15:04:55 EDT 1998 | Jeff T
I am a printed circuit designer with a lot of mixed technology designs. I am searching for information on how to eliminate the wave solder step and reflow the the through hole components. If anyone has experience in reflowing smt and through hole c
Electronics Forum | Wed Sep 02 12:08:25 EDT 1998 | Dick Casagrande
| I am a printed circuit designer with a lot of mixed technology designs. I am searching for information on how to eliminate the wave solder step and reflow the the through hole components. If anyone has experience in reflowing smt and through hole
Electronics Forum | Tue Sep 01 16:52:45 EDT 1998 | Ryan Jennens
| I am a printed circuit designer with a lot of mixed technology designs. I am searching for information on how to eliminate the wave solder step and reflow the the through hole components. If anyone has experience in reflowing smt and through hole
Electronics Forum | Fri Sep 04 16:23:48 EDT 1998 | Dave F
| | I am a printed circuit designer with a lot of mixed technology designs. I am searching for information on how to eliminate the wave solder step and reflow the the through hole components. If anyone has experience in reflowing smt and through ho
Electronics Forum | Mon Apr 02 20:47:22 EDT 2001 | davef
Cuppla questions for ya ... Where are the shorts [above the mask or between the mask and the laminate]? On the board, what material is between the copper traces and the mask? What type of solder mask(s) used by your suppliers? What are they using
