Electronics Forum | Mon Jul 23 12:31:03 EDT 2007 | gmoritz
Have you tried running it in step mode? Yes, and more. The installer asked me to run a few tests: 1> Intentionally make the machine miss insert a part then put a part in manually to see how the leads align to the cutter head. 2> Push the re
Electronics Forum | Tue Aug 28 11:54:25 EDT 2007 | rgduval
Dave, To tell you the truth, I couldn't tell you. I came into this company with the system installed. When the resistivity is depleted, I call Culligan. It may only be an in-line cartridge filter that they change. We've noted a change in water q
Electronics Forum | Thu Oct 11 14:56:27 EDT 2007 | chef
Thank you- my point exactly and it starts in SMT- operators pulling the wrong paste from the fridge, touch up using the wrong solder wire, etc. My solution- GET THE LEAD OUT!!!!! I'm a CM- high mix, low to medium volumes. No steady all day every day
Electronics Forum | Wed Nov 07 12:58:20 EST 2007 | Frank
I agree with Jon, that using Gerber data is a pain in the butt, but that doesn't answer your question about what software to use. CircuitCAM, VALOR, UniCAM (now Tecnomatix), and GC Place are the more popular third party software packages that deal d
Electronics Forum | Mon Nov 12 09:22:41 EST 2007 | devajj
BTW, The surrounded QFN fine pitch terminals > should have the normal aperture reduction of 7 % > in case of RoHS Senju solder paste. This works > for our Telecom customer. > > The vias in the > ground pad will be somewhat filled with solder >
Electronics Forum | Tue Jan 08 10:10:29 EST 2008 | noid
We are building class 3 products, using no clean on wave and selective solder machines. Both processes are producing micro solder balls between the leads of through hole components. I have searched the site and haven't found any recent threads on h
Electronics Forum | Tue Jan 15 16:44:54 EST 2008 | gregoryyork
I found some machine manufacturers put convection nozzles in line parallel with each other instead of staggering them so you get a nice parallel line up the board where there is no flux be it no residue alcohol or VOC Free. The best I could find was
Electronics Forum | Fri Mar 14 11:25:02 EDT 2008 | hegemon
ol' hege has got to agree with Chunks and Dave. Seems every time there is a problem, the finger is first pointed at the process. For my $.02 it doesn't matter if your process is 100% bulletproof, procurement will screw it up by finding a vendor that
Electronics Forum | Tue May 20 17:09:13 EDT 2008 | davef
Sorry, we didn't do a good job of understanding your question. For more on delamination, look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=54655 ... but we're not so sure that this is a straight delamination issue, because: * One
Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika
Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp
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