Electronics Forum | Wed Aug 25 15:51:58 EDT 1999 | JohnW
| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons
Electronics Forum | Wed Aug 25 17:09:53 EDT 1999 | Earl Moon
| | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Co
Electronics Forum | Mon Aug 02 18:52:57 EDT 1999 | Graham Naisbitt
| Very shortly I will be evaluating OA flux and aqueous cleaning to replace our RMA and solvent cleaning process. I am primarily interested in batch aqueous cleaners for reasons of budget, floor space, etc. I am concerned about the ability of H2O t
Electronics Forum | Thu Jul 29 21:00:27 EDT 1999 | Dave F
| Thanks Earl for your insight! I sometimes feel conspicuous as one of the few women I've seen frequenting this board, but everyone's been helpful and has resisted the overwhelming temptation to pat me on the head. | | From what you and some of the
Electronics Forum | Fri Jul 23 14:07:52 EDT 1999 | Carl J. Odle
We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after a p
Electronics Forum | Fri Jul 16 14:34:18 EDT 1999 | Glenn Robertson
| We are converting from COB to SMT on a product line and want to optomize the PCB as far as Laminate, plating, passivation etc. This is a high temp application 150C. We are presently using BT Laminate but would like to get away from this. We are
Electronics Forum | Thu Jun 17 09:50:27 EDT 1999 | Brian Wycoff
| | WOULD LIKE TO DO RELOW OF 2 SIDED SMT BOARDS. USUALLY THE BOTTOM SIDE HAS RESISTORS AND CAPS ONLY. WHEN THE BOTTOM OF THE BOARD HEATS UP, THE PARTS ARE FREE TO MOVE AND ONLY SURFACE TENSION WILL KEEP THE COMPONENT FROM FALLING OFF. | | CAN BOARDS
Electronics Forum | Sat Jun 12 10:23:18 EDT 1999 | Dean
| How are you inspecting pcbs post-reflow, are you inspecting all or sampling. The type of assembly involved would be mainly chip components with a mix of actives and a few 25mil and under pitch. | If you sample what are your fault rates looking lik
Electronics Forum | Fri May 21 15:23:24 EDT 1999 | JohnW
| | Has anyone had any experience or data using vibration during the reflow process. | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process work
Electronics Forum | Fri May 14 13:42:21 EDT 1999 | andy blair
I am currently an employee of Cabeltron Systems in Ohio. Our manufacturing divisions have been outsourced to Celestica, strictly a business deal. No hard feelings there. Our building is located in Southern Ohio and will soon be vacant with 300 people
