Electronics Forum | Wed Feb 09 10:20:26 EST 2000 | Sal
Currently we have started seeing an issue around a scuzzy connector.The problem being that during insertion of this connnector a couple of pins refused to be inserted and as a result fold over, this folding of the pin is causing the pin itself to fra
Electronics Forum | Tue Jan 09 13:20:54 EST 2001 | JAX
Charlie, You might want to take a look at Valor. They have Package naming based on JEDEC/EIA standards already cataloged on an SQL-based library. Although the software takes you through the entire process of Data integration through Machine op
Electronics Forum | Fri Jan 05 13:40:04 EST 2001 | Steve Thomas
Is my employer living in a vacuum? Are we the only ones doing this? I can't find anything in the archives on this topic, so forgive me if it's been hashed over before. Our major chip supplier is giving us less than a year to convert our products o
Electronics Forum | Fri Jan 05 15:14:27 EST 2001 | Mark Krmpotich
Currently where I work, we are busy running trials with smaller component sizes. Consumer Electronics is being driven to smaller and smaller products. Just look at the short history of the cell phone. Remeber when they used to look like Army Walki
Electronics Forum | Fri Dec 22 10:29:49 EST 2000 | CAL
I searched the internet to find out more on your plastic fingers and came up with a little info. http://thinkingproductivity.com is the only link I could find for "plastic Fingers" Here is the clip from there site:"We represent Jafco's full line of
Electronics Forum | Wed Dec 20 16:54:28 EST 2000 | ronh
Question: How many insertion/removal cycles can be expected of gold finger contacts? Problem: We manufacture a class 2 PCBA with gold finger contacts whose application will require repeated insertion and removal into card edge connectors (mother b
Electronics Forum | Wed Dec 20 16:54:07 EST 2000 | ronh
Question: How many insertion/removal cycles can be expected of gold finger contacts? Problem: We manufacture a class 2 PCBA with gold finger contacts whose application will require repeated insertion and removal into card edge connectors (mother b
Electronics Forum | Thu Dec 14 19:32:05 EST 2000 | Dave F
Wow, someone read the fine SMTnet Archives!!!! Scary, get their name!!! [OK, I�ll stop ... Several points are: * Most of the stuff in the fine SMTnet Archives is all the bad things that we can make-up to respond to the questions people ask. Ther
Electronics Forum | Fri Dec 15 13:57:46 EST 2000 | genny
It is only after the reflow heating process that the peaks may show up, as the solder build up in some vias(due to HASL'ing) might drip down during reflow. I don't think I've ever heard of it being desirable to have a bare copper surface that will ox
Electronics Forum | Tue Dec 12 15:22:50 EST 2000 | Michael Parker
Dave - the most significant difference between the two titles (that I have experienced) is the location of assignment. Usually MFG. Eng.'s are responsible to a fixed set of equipment and are more concerned with how the product acts within the machine
