Electronics Forum: product (Page 591 of 870)

Marketing in Japan

Electronics Forum | Tue Apr 03 17:15:34 EDT 2001 | jdtpfacreate

Ryan, It is a must that you try to get a partner in Japan that can help you market your product. Japan is not a very open marketplace. Many of the companies will only deal with other Japanese companies. I used to work at a company that was suc

Stencil Cleaning

Electronics Forum | Fri Apr 13 07:46:03 EDT 2001 | gsmguru

We actually switch stencils at the end of each 8 hour shift. We have two for each job #. Operators get one clean one from the rack and put the used one in the Washer for the next shift. Since we started doing this our DPMO for solder defects (Bridgin

Stencil Cleaning

Electronics Forum | Fri Apr 13 14:08:53 EDT 2001 | CAL

Proper setup and cleaning of stencil helps ensure repeatable printing performance. Cleaning processes need to be compatible with materials used in the manufacturing of stencils and solder paste. IPC 7525 should also help you out. We here would Inspe

Electroless Nickel/Gold finish

Electronics Forum | Tue Apr 17 08:29:12 EDT 2001 | Geertjan de Beijer

My name is Geertjan de Beijer and I am new on this forum. I have a question about Electroless Nickel/Gold finishes. Until now we always use a HAL finish on our PCB's. Since we are using compontents with pitches of 0.5mm we notice that the HAL finis

Part sliding in reflow?

Electronics Forum | Fri Apr 20 11:07:52 EDT 2001 | kawiederhold

Hi Dave, Good to "talk" to ya again!! I have attached a photo of the antenna. Hopefully it will work its way through the system. The pictured antenna meets all our criteria. The defective antennae all seem to slide toward the center of the PCB (

Part sliding in reflow?

Electronics Forum | Fri Apr 20 16:11:29 EDT 2001 | davef

Good to talk with you too. Oh, just the way I had it pictured!!! Yeh, right!!! [http://davesmt.50megs.com/pictures select kristenna.jpg ] Which part of the antenna "sees" heat first [Are all legs (vertical part), two legs, or one leg of the anten

Flip Chip

Electronics Forum | Sun Apr 22 23:46:28 EDT 2001 | z1040223

Hello all My company is getting ready to implement solder bump flip chips in the production line in the future. We are a contract manufacturer. We currently have the SMT facilities to do up to 1.5mm pitch BGA's, 0402 and other standard SMT. What equ

Cost effectiveness

Electronics Forum | Tue Nov 28 12:05:04 EST 2000 | Garth Fitzner

Hello from Edmonton Dr. Abell! And hello from a currently enrolled Athabasca University student as well! My company is a small one. We have 12 people, only seven of whom are the assemblers and testers. We manufacture our own products and have our ow

Re: Thermal fatigue of solder joints

Electronics Forum | Thu Oct 26 09:10:30 EDT 2000 | ptvianc

I am not familiar with the "HALT" terminology. Do you mean HAST testing? As for thermal fatigue, the most severe conditions are typically those cited for military and/or satellite applications. There are several temperature ranges that are used to

Re: No-lead solder

Electronics Forum | Thu Jun 22 16:59:18 EDT 2000 | Lee

I'll be real brief, because of time, but feel free to contact me later (lgoldberg@chipcenter.com). There is big conceren (somewhat well-founded but a bit overblown) about lead form electronics products leaching into the environment when they are land


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