Electronics Forum | Mon Mar 24 16:49:42 EDT 2008 | paulv
Fellows, First of all, thank you for taking the time to respond to the post, however some of you missunderstood the main objective of it. I was basically trying to find historical and current average market prices for solder products. Metal informati
Electronics Forum | Tue Mar 18 14:00:25 EDT 2008 | rrpowers
There are 2 reasons for wanting to change to an enclosed print system: - Reduce solder paste usage. (We run a high volume application so any reduction in paste scrap is a big money saver to our company.) - Improved print quality. (Ours is a non-rew
Electronics Forum | Wed Apr 02 13:56:03 EDT 2008 | slthomas
So your golden board isn't a valid representation of your production material. I don't use AOI but it sounds like either you need a vendor that can guarantee the same part marking appearance as you originally programmed to (not likely) or you need a
Electronics Forum | Sat Apr 12 08:50:33 EDT 2008 | davef
Mika Regarding your boot story: In America, we have absurd product warning label responces to people being idiots: http://www.mlaw.org/wwl/pastwinners.html Regarding your comment on OSHA: Yes, OHSA defines eye safety requirements. Then in addition,
Electronics Forum | Wed Apr 09 22:58:10 EDT 2008 | davef
We wonder about: * Solder mask encroaching onto the component pads. Please describe the solder coverage on pads where there is tombstoning. * History of the issue. How long has this been going on? Have you ever produced non-tombstone board consisentl
Electronics Forum | Tue Apr 15 08:24:48 EDT 2008 | pima
Hello I would like to ask you what kind of production do u treat for high mix and low volume. I mean what is your definition for this high mix and low volume - is 5 changovers for shift is high mix and low volume technology? And what kind of SMT p
Electronics Forum | Fri Apr 25 12:36:52 EDT 2008 | fsw
All, Does anyone on the forum have experience with underfill? We have a component with QFN pkg on one of the new products. It has a thermal pad in the centre. Customer wants this component to have an underfill. Questions - 1) Does one normally req
Electronics Forum | Thu May 01 09:09:31 EDT 2008 | scottp
I looked at some no flow underfills about 5 years ago and they weren't quite ready for prime time yet. It's time to give it another look and I'm wondering if anyone is using them in production and how it's working. I'm looking at them for reducing
Electronics Forum | Fri May 09 15:16:42 EDT 2008 | toddl
I thank everyone for their input, I have ordered a few missing parts and will try the auto dispense feature. I believe our production floor humidity is properly controlled so hopefully no problems in that area. I do have concerns with the dispenser s
Electronics Forum | Tue May 06 22:15:06 EDT 2008 | davef
We agree. We consider mounting holes and press fgit socket pads to be "critical contact areas." Consider taking steps to prevent the production of such solder splats on your gold to help elimate gold rework. We discussed this previously here on SMTn
