Electronics Forum: production (Page 591 of 870)

Re: ESD Labels on Workstations, mobile carts, shelving, mini-tables, chairs ....

Electronics Forum | Thu Jun 01 08:54:50 EDT 2000 | Chris May

Dear Ashok, My practice is that if you see it as a source of a potential problem, label and monitor/measure/test it. OK, so it may be a lot of work up-front, but what is the risk involved in not doing it ?? There is no grey area, do all or nothing

Re: DEK 265 opinions needed please

Electronics Forum | Fri May 26 02:22:18 EDT 2000 | Sal

Generally a good and safe option when selecting a printer, A rhobust machine with good process capabilities. We print anything from 0402's to CCGA's using proflow, as well as print adhesive with no problems. The 265 ranges from the MK1 TO Infinity mo

Re: intrusive reflow with OA paste

Electronics Forum | Wed May 24 15:28:09 EDT 2000 | John Thorup

Hello Travis I'm going to have to disagree with your evaluation of intrusive reflow. It's not just for low end and,if done correctly, you will not have lots of half soldered leads and touch up will be minimal if at all. I'm sure that others will ag

Re: intrusive reflow with OA paste

Electronics Forum | Thu May 25 17:18:45 EDT 2000 | Boca

I have not done pin in paste in production quantites, but speculation is always a blast so; OA fluxes are active at room temperature, they grow 'fur' with humidity if not washed off, great stuff for soldering, nasty stuff for reliability (if not rem

Re: IPII v.s IPIII

Electronics Forum | Thu May 18 23:22:44 EDT 2000 | Micah Newcomb

Jerry, Contact FujiAmerica and ask for their newest product Guide. Some differences are..... IP2 - SMD1 vision (back lighting only, coplanarity check optional) IP3 - SMD3 vision (back, front, coplanarity check optional) IP3 - BGA transport, I

Re: SMT assembly on Punch/return boards

Electronics Forum | Fri May 19 10:39:19 EDT 2000 | Boca

Ed, I workded with punch and replace fabs yeeeeears ago, major pain! Dave's right, planarity is the biggest problem, then inconsistent retention in the panel, then ANY retention in the panel. If you can get paste on them, you may be able to place

Re: SMT assembly on Punch/return boards

Electronics Forum | Fri May 19 10:41:06 EDT 2000 | Boca

Ed, I workded with punch and replace fabs yeeeeears ago, major pain! Dave's right, planarity is the biggest problem, then inconsistent retention in the panel, then ANY retention in the panel. If you can get paste on them, you may be able to place

Gold finger Protectors

Electronics Forum | Sat May 13 07:03:16 EDT 2000 | Sal

guys, Currently running a very high volume product, with the gold fingers at the edge of the board masked off using Kapton tape to avoid any form of contamination during reflow and wavesoldering. I've heard alot of about the gold finger gloves, my q

uBGA rework and X-Ray inspection

Electronics Forum | Thu Apr 13 18:28:01 EDT 2000 | Michael Parker

Hello - I am currently evaluating uBGA rework and X-Ray inspection solutions. I would like any advice/warnings etc. regarding suppliers and equipment. I have already researched through the threads in this forum and have created a list of recommended

PCB finishing

Electronics Forum | Thu Apr 13 03:46:19 EDT 2000 | PeterB

We are a small/medium contract manufacturer and like most we do our best to ensure that PCB's we process are panelised to ensure efficient throughput and good quality results. Sometimes however we are stuck with free issue PCB panels supplied by som


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