Electronics Forum: profil (Page 121 of 462)

BGA Reflow profiles

Electronics Forum | Tue May 12 16:04:24 EDT 2009 | microdot

hi, we have recently got a PS-400 BGA reflow from china. has hot air top heater, IR & hotair bottom heater and 6 IR bottom heaters. We are able to handle all type of desktop boards but in few of the laptop boards we still have problem. The profiles

BGA pads lifting from PCB

Electronics Forum | Thu Jul 02 13:10:22 EDT 2009 | kpm135

On first glance it looks like those particular pads were not attached to any traces. If I had to guess I would say that your rework profile got hot enough to melt away the glue holding the pads to the board and they came away with your part when you

DRS24 BGA PLACEMENT PROCEDURE?

Electronics Forum | Fri Oct 09 02:54:57 EDT 2009 | omid_juve

Dear sir`s i want to place one TBGA144 with DRS24 rework station i use many different profile but with near all of them in the ramp stage and reflow stage the balls of the BGA thrown away from the part and cause many short circuit under it and also m

BGA Voiding for RoHS

Electronics Forum | Tue Nov 10 12:23:38 EST 2009 | CL

Good Morning, I agree. This has been a problem job for us. They are looking for anything that could be implicated. Right now, they are focusing on the profile. My question pertains to the frequency of micro voiding on BGA devices. I have seen some

Profiling on rail vs mesh conveyors

Electronics Forum | Mon Dec 14 13:55:24 EST 2009 | dyoungquist

Yes, there will be a difference. When the board is on the rail conveyors it is closer to the top heaters and farther away from the bottom heaters than when on the mesh conveyor. That difference will create different temperatures on both sides of yo

Solder cover

Electronics Forum | Wed Mar 03 18:42:29 EST 2010 | 89jeong

Hello Graham Copper. Thanks for yr comment. I will review the pad size and component placement with our engineer. It looks that the placement of lead is wrong. But what i want to hear from you is about solder lump on the right.As you can see, the sol

BGA REFLOW

Electronics Forum | Fri Jan 07 03:34:12 EST 2011 | rpatel28364

Hi Smarts We are having difficulty in reflowing BGA wiht ROHS process on double sided board. We have tried profiling un populated board and profile is meeting upper spec of solder paste. but our customer is saying they have to heat up BGA and board s

GF-12 APS oven

Electronics Forum | Mon Jan 31 08:59:38 EST 2011 | kennypascarelli

I have an oven that now wants me to tune and can't do anything until I enter a password. The big problem is I don't know the password. Any way to find it or bypass it. Figured it out, the machine has a battery back-up and it needed to be replaced.

Switch to New Reflow Oven

Electronics Forum | Tue Feb 08 19:24:30 EST 2011 | swag

We are going to buy a new reflow oven this spring. It will replace one that is currently on-line. I have a small handful of golden boards wired with thermocouples and a ton of data to support the transfer of those specific builds. The hurdle is th

liquidous (indium 8.9hf)

Electronics Forum | Thu Apr 07 11:39:48 EDT 2011 | remullis

My oven profile is 155,160,165,180,220,245,255,227 Cooling Zone 132/92. This is a 8 zone CV820 Technical Devices oven. My assy profile using Datapaq Q18 - Base on one probe feedback - Positive slope (7.09), Pos Slope Time (.45), Rise Time (1.17), Me


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