Electronics Forum: profil (Page 156 of 462)

Solder on gold finger

Electronics Forum | Tue Jul 18 10:16:49 EDT 2006 | russ

Clean up!, check all conveyors for paste, the printer, oven. If you are splattering in the oven than you need a better profile or better paste, one of the two, maybe both. Hope was helpful Russ

Solder on gold finger

Electronics Forum | Tue Jul 18 11:49:24 EDT 2006 | slthomas

How does your profile fit the paste manufacturer's specs? It sounds like you could be ramping up a little fast and boiling your non-metal constituents.

Solder on gold finger

Electronics Forum | Tue Jul 18 19:20:25 EDT 2006 | sharifudin

Actually we run lead free solder paste and the profile spec very tigh.I can't use capton tape due my product in panel form and save cost.I already verify conveyor,machine and tool free from dust and solder paste but the problem still remain.

thermocouple wire

Electronics Forum | Thu Jul 20 17:44:36 EDT 2006 | fordf1502004

when I order a thermocouple wire for doing oven profiles, it comes in a standard length of 36 inches, will there be any effects if I were to cut the wire down to 9 inches? Will cutting change the readings?

Components Solder Short

Electronics Forum | Fri Jul 21 13:42:11 EDT 2006 | Chunks

Paste too thick. Paste not aligned on pad. Part not aligned on pads. Part leads not straight. Oven profile. Paste slump from warm board. Operator before oven thinks they can place IC better than placement machine - so plays IC hockey with part. Oven

Blistering issue, mixed LF/SnPb process

Electronics Forum | Fri Jul 28 08:51:50 EDT 2006 | russ

Are all these defects related to the trace that enters pad? Looking at #2, the good fillet has side trace entry and the bad has front entry. I would suggest that a profile check is in order, then the paste would be next culprit. Russ

conceptronic password

Electronics Forum | Mon Jul 31 06:35:08 EDT 2006 | kevin

Hi all, Does anyone know the default passwords for a conceptronic profile 160. I need levels 1, 2 and 4 thnks in advance

Solder Ball After Reflow Process

Electronics Forum | Fri Aug 18 09:28:24 EDT 2006 | russ

okay, very admirable, so you will need to answer the rest of the questions that were posed. Such as the actual profile, storage and handling, registration of paste, etc.... I would lean towards Chunks thoughts myself as well. Russ

Reverse Spike

Electronics Forum | Thu Aug 17 09:38:28 EDT 2006 | pjc

Having the last two zones at the reflow temp (spike) is typically done on long ovens (10 zone) running at high conveyor speeds. This enables you to achieve peak temp and TAL as per the solderpaste specs at high production rates. Concerning reverse sp

Non wetting on fine pitch product

Electronics Forum | Thu Sep 07 09:08:57 EDT 2006 | Bubba

OK, part touching paste before reflow? Check part. Maybe bad plating. Check reflow profile by slowing conveyor.


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