Electronics Forum | Thu Jan 31 07:02:00 EST 2002 | martino
The whole process counldn't be easier. The sales reps' try to turn the whole thing into some crazy black art-its not. The stencil supplier will have their own standard 'glue dot' configurations, and 9 times out of 10 these are more than adequate. As
Electronics Forum | Fri Feb 01 10:19:22 EST 2002 | cyber_wolf
Whoa! I beg to differ my friend. The cure profile is VERY critical in Adhesive curing, especially if your are screen printing. When you screen print adhesive you are leaving it exposed to the atmosphere for a period of time. SMT adhesive by nature i
Electronics Forum | Fri Feb 01 06:15:46 EST 2002 | nifhail
This can be a solution for IC/BGA soldering for lead-free process isn't it ? See, most of the reflow profile set meets solder paste specification but often violating ICs or BGA requirement. Most of the solder paste required temperature of about 205 -
Electronics Forum | Tue Jul 30 17:47:50 EDT 2002 | davef
Dewetting: Solder does not adhere to lead or land, caused by: * Poor solderability of lands. * Poor solderability of leads. * Solder paste integrity. * Lead plating integrity. Need more information, please: * What is dewetting [ie, component, pad, e
Electronics Forum | Mon Aug 12 12:05:35 EDT 2002 | russ
I use Paste for high temp balls and/or co-planarity/warpage issues. normally I only use paste flux for ball attachment. One down side to paste application is registration and volume anomalies with those little micro-stencils (for me anyway). Your
Electronics Forum | Tue Oct 29 15:07:38 EST 2002 | gregp
SOP small outline package, SOIC small outline integrated circuit, VSOP very small outline package, TSOP thin small outline package,TSSOP thin shrink small outline package, QSOP ???, LQFP low profile quad flat pack, VQFP ??? The packages come and go
Electronics Forum | Fri Nov 22 17:55:39 EST 2002 | robertorre
Your problem may be related to different aspects. 1. Oxidation on landing pads. 2. Either high(To long over liquidous temp) or low temp. 3. Bad solder (not enough vehicles) Run this test: Set a hot plate to 220 degrees C. Make sure you have proper ve
Electronics Forum | Thu Dec 12 09:21:42 EST 2002 | blnorman
What we did: *Slump-dot diameter and height as a function of time *Print Speed-Vary speed, measure slump and missing/defects *Green Strength-We quantifiably measured tack vs time and we placed components and measure skew by SVS *Cure profile sensitiv
Electronics Forum | Sun Dec 08 22:20:39 EST 2002 | grantp
Hi, We have been manufacturing a PCB, however it's been quite tricky to profile, as the edges of the PCB are reflowing before the center of the PCB. I have looked at the design, and there is a small power plane for 2.5 Volt in the center of the PCB
Electronics Forum | Mon Jan 20 22:39:46 EST 2003 | davef
Hi Stevo, Most paste suppliers say something like, �above 183*C for 45 to 60 seconds.� The problem we have with statements like that is that they seem to assume that the pads, component leads, and solder paste are all near eutectic 60/40 solder. A
