Electronics Forum | Thu Apr 16 10:11:51 EDT 2015 | hugh_manatee
Your solder paste manufacturer’s profile is just a “guideline.” You can customize your profile to meet your product’s need. For better grain-structure (shiney-ness) try a ramp soak spike profile keeping your preheat temps very low before your reflo
Electronics Forum | Fri Sep 04 04:39:08 EDT 2015 | grahamcooper22
Maybe look at reducing the time above liquidus to @ 60 seconds. HF materials tend to want tighter reflow profiles...halogen activators are great at higher temps and longer reflow profiles..but HF prefer shorter profiles. The HF pictures look like the
Electronics Forum | Wed Feb 01 00:25:09 EST 2017 | shahrat
What is the method of Reflow profiling for a duel line reflow?? I am planning to have a duel line Reflow oven for cell phone production. As 2 types of PCB ( Top + Bottom) will enter machine at the same time and both will have different numbers of mou
Electronics Forum | Tue Mar 27 15:21:03 EDT 2018 | dph150
Can you make a copy of the software for me? It should be small enough to zip and email if you take out all the profiles. I don't have the disk and if you use the make disk option it keeps all the setting on that disk. Its a pain having to go edit eac
Electronics Forum | Tue May 07 10:36:38 EDT 2019 | slthomas
Probably just means you started out with an optimal profile. I suspect that not everyone does. ;) It seems like we did have some luck with profile adjustments in one instance with some QFN's with a large thermal pad. Like I said, though, the profi
Electronics Forum | Tue Aug 13 02:33:04 EDT 2019 | ameenullakhan
Hi , Thanks for the reply. Yes CCGA was checked before placement and sending to reflow oven. The latest suspect form few cross functional team member is like. It is due to improper reflow profile " Column kick out " has happen. I am
Electronics Forum | Mon Nov 27 22:01:57 EST 2023 | emeto
It is about thermal mass and heat dissipation. If you want to be accurate, you should profile each one. If you want to be efficient, You should design all panels to come to the same size. This way variation from panel to panel will be minimal (given
Electronics Forum | Wed Feb 23 14:44:28 EST 2000 | Travis Slaughter
Your solder paste manufacturer should determine the time. As far as temperatures those will very with each board. Creating a profile comes down to trial and error, there are some nice tools that help, the MOLE profiler is one, but there are just wa
Electronics Forum | Wed Feb 23 20:29:43 EST 2000 | Rex B
ECD is working on some tools in the area of determining the Ideal or most Robust Profile, for a given paste, oven configuration and conveyor speed. Translation of this "most robust profile" into actual oven setting requires more knowledge about the
Electronics Forum | Wed Apr 19 18:02:34 EDT 2000 | Mike Flori
If you can divide your boards into different categories it allows you to determine a different starting profile for each category, based on size, # of layers, etc. When you get a new board to profile you'll have an idea what settings will get you clo