Electronics Forum: profil (Page 216 of 462)

Reflow profile negative temp ramp rates

Electronics Forum | Thu Apr 11 11:26:34 EDT 2002 | johnw

Dave, I sand corrected since I know you wouldn't steer me wrong...although the lst time I looked at the IPC spec for a solder profiel it was still designed for older generations of paste and were specifically water wash biased although that doesn't c

Gold plated PCB's

Electronics Forum | Fri May 10 13:52:46 EDT 2002 | pjc

FYI: not all OSP are created equal. I have had expierence, both good and bad w/ OSP boards. To qualify the vendor I would take a bare board and run it thru my oven twice on a reflow profile then flux it with NC flux and run it thru the wave solder fo

Immersion Ag

Electronics Forum | Mon May 06 21:39:46 EDT 2002 | Yannick

Hi, I would like to know if someone is using a immersion AG for their board and if this plating modify the property of the solder paste? do I need to make changes on my temperature profile? We want to change from HASL to Immersion AG to mount

Solder particals in the oven?

Electronics Forum | Tue Jun 04 15:58:06 EDT 2002 | Hussman69

Hmmm... I know the Vitronics oven had bigger motors on em', but I don't think they're blowing molten solder balls around. You did say you changed your profile and stencil designs, which helped, but didn't exactly state what ya did. I believe this

0201 and uBGA

Electronics Forum | Mon Sep 23 18:11:10 EDT 2002 | steveb

On an assembly reflowed in air saw the same thing: 0201's with a grainular solder joint, but 0402's and above with perfectly formed joints. Reflow profile all within acceptable tolerances. Reflowing in nitrogen solves this problem, but increases t

Solder Bridging on BGA

Electronics Forum | Fri Jun 14 18:01:04 EDT 2002 | john_wsme

Dave and Russ, Today we modified the profile to ramp up slowly and have longer preheat time. The result is great, 0 out of 5 without bridging. I did review the FAB design and seen the pad is much biger than ball size. So I guess it is the problem.

Soldering BGA

Electronics Forum | Tue Jun 25 07:12:46 EDT 2002 | Daan Terstegge

Because BGA's are so hard to rework, you'll want the maximum process window for your reflow equipment, and this includes an inert atmosphere. But as long as solderability and temperature profile are well controlled you can have perfect results with a

Wave Pallet Lifespan

Electronics Forum | Mon Jul 15 15:09:45 EDT 2002 | peterson

Hi all, I am trying to find some data that will show me the typical lifespan for a wave pallet. I realize that it depends on material used (Durapol, for instance) temp profile, etc and I HAVE checked the fine SMT archives... Anyone have an average n

Super M.O.L.E or Slim KIC 2000 for oven profiling?

Electronics Forum | Tue Jul 30 14:07:01 EDT 2002 | cnoonan

Slim KIC would be my choice out of these two vendors. I have worked with several different makes and models and I would say DataPaq was my favorite. But it all depends on your needs and budget. They can all get the job done. Good luck with your

Aqueous cleaner water disposal

Electronics Forum | Sat Sep 07 06:57:33 EDT 2002 | mk

I agree but, are there really heavy metals in this water? Our process is as follows. Print Paste Reflow Board (no components, water soluble paste only) Wash Board Same reflow profile for almost every order so no solder balling issues etc. Carbon an


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