Electronics Forum | Wed Oct 19 14:03:47 EDT 2022 | proceng1
Low Temp solder and a cooler profile should certainly help. I do believe that the unbalanced copper is the culprit, but you could try to prebake some boards. To eliminate some kind of manufacturing defect from the equation. Though I'm pretty sure i
Electronics Forum | Wed Oct 19 14:15:43 EDT 2022 | proy
Thank you all a but the easy fix - of correcting copper - is not an option -actually no changes to the board can be done simply they way it is.... I will look at post reflow bake above TG but I don't want to add a process.... Will look at profile als
Electronics Forum | Tue Nov 01 18:41:10 EDT 2022 | griinder
misc. Info), and the profile in component editor under the other tab. Default is 20. There is a way to change numerous values at once, but it takes a hidden click and password to do. First verify both places for a part are set to 20. Is it possible
Electronics Forum | Tue Jul 18 00:02:41 EDT 2023 | hazira1991
Yes. i do check all the parameter all seams good. I did compare my solder paste printing and profile with previous lot that did not have any BGA solder short issue which we run at the same line did not have any much difference. During rework also i
Electronics Forum | Wed Aug 02 06:48:56 EDT 2023 | kirill
Use T5 solder paste Make sure you dont have too much paste, usually 1 time printing instead of 2. Make sure the component is baked before production. Re-check your profile on the reflow. Could be also a bad pcb edit, nothing you can do there.
Electronics Forum | Mon Aug 07 20:43:42 EDT 2023 | smith88
I am looking for some tips of the trade with solder charges. I am using recommended reflow profile in the oven and I am seeing insufficient fill per IPC, and sometimes insufficient end joint. I have tried dipping them in flux also. What are you a
Electronics Forum | Fri Sep 22 08:22:17 EDT 2023 | linux
Hello All, This would be a question for someone with experience in PCB design, Intrusive reflow Narrow profile connector(Electrode Rectangular) L=1mm X W=0.9mm. What shape and size hole is required in the PCB to ensure sufficient solderability and re
Electronics Forum | Wed Nov 08 10:48:34 EST 2023 | processman
Hi Was wondering what the general take is with reflow profiles to take into account differing solder paste alloy compared to the solder alloy used for the bumps of a bga device. For instance, SAC305 solder paste and BGA device with SAC105 (higher m
Electronics Forum | Mon Nov 13 18:36:32 EST 2023 | emeto
Your reflow profile should be designed towards the flux in your solder paste. To form a proper inter-metallic layer, you need to reach 20-30C above your melting point and stay in liquidus state for certain amount of time. SAC 105 has 3C difference fr
Electronics Forum | Fri Feb 23 09:12:13 EST 2024 | carl_p
How have you created the oven profile? Have you taken into account the heat soak from the components/board/carrier etc. Is the paste being mixed correctly before use, is the paste in its use by date & at ambient temp etc? I thought almost all the
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