Electronics Forum | Wed Jan 03 10:34:18 EST 2007 | dphilbrick
Your failure rate should be as good or better than any other leaded part on your board. Have you done a reflow profile on this board. We typically sacrifice a board and drill a hole from the bottom and then imbed a probe under the part to get the tem
Electronics Forum | Wed Feb 07 16:16:10 EST 2007 | mr
I have seen this before. Check: --Vibration of belt --Interference (part getting "brushed off" while reflowing bottom-side components --Some glues' cross-linking mechanism is impaired by the flux during migration in reflow, redering the glue useless
Electronics Forum | Tue Jan 09 21:21:22 EST 2007 | behrsam
I am soldering a Germanium Window with a metalized rim to a Ni-Au plated kovar lid. The solder joint needs to be hermetic. I am using 80In solder washer shape preform, but am experiencing lots of voiding when x-rayed, although the joint is sealing.
Electronics Forum | Tue Jan 23 17:27:14 EST 2007 | russ
Well I am a CM, it has to be that OSP finsh!!! hahahaha seriously I hate that finish. but this is big BGA and there could be a multitude of issues as you suggested. Do not assume that the boards were 100% tested for all vias and lines unless yuou
Electronics Forum | Sun Feb 25 03:49:17 EST 2007 | frank63
Dear SMT community, thank you all for your comments and valuable hints. I am newcomer here and impressed about the feedbacks! We have made a new lot of 25 pcb with total 200pcs of (leaded) BGA, whith slightly higher temperature profiles ~210�C
Electronics Forum | Wed Jan 31 17:57:07 EST 2007 | blnorman
We've had multiple issues with non-wetting components. You say only one part is not wetting? Profile won't be the culprit, if so you would have more part issues. We've used SnPb with lead-free parts for some time now, no issues. The issues we had
Electronics Forum | Tue Feb 20 08:19:54 EST 2007 | Steve
One question about the build to print statement; is there some note saying that the vias are to be plugged with mask? If so, I'm wondering when the circle of mask was done over the vias. If it was done as a secondary operation after flood coating, t
Electronics Forum | Fri Feb 09 08:07:41 EST 2007 | jax
Has the board been looked at under X-Ray? Have you built more than 1 of the boards in question? Do any of the other boards have the same problem? Have you made any changes to the profile between boards? One side of the BGA collapsing during reflow w
Electronics Forum | Sat Feb 10 09:36:52 EST 2007 | davef
Choices are: * Run a Cp, Cpk capable profiler through the oven. * Review the results of your supplier's process qualification that would include Cp, Cpk on their oven. Handspring contract [REV. 6 - 7/1/99] with Flextronics says: [snip] 4. Process Ca
Electronics Forum | Mon Feb 12 10:06:46 EST 2007 | CK the Flip Guy
DaveF, Please define a "Cp/Cpk capable profiler." Do you mean one that has software that automatically calculates this for you? I do this at my company, and we track 2 critical variables - Time Above Liquidous and Peak Temps. and this is done on a
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