Electronics Forum | Fri Mar 23 14:13:20 EST 2001 | mnaddra
RW, I have Screened Adhesive on to several different assemblies and have found that when it is possible I get a much better result than with a dot deposition process (The green strength was greatly improved), the biggest issue I ran in to was the pr
Electronics Forum | Tue Apr 03 22:03:18 EDT 2001 | davef
With friends like you, who needs enemies? I�d guess that the perceived benefits of flat pads for your 20 mil pitch and below components counter-balance the higher cost, gold being a solder pot contaminant, limited solder mask compatibility, potentia
Electronics Forum | Sat Jun 09 00:53:34 EDT 2001 | ianchan
Hi Folks, My Production runs a uBGA-liken product, and uses Pallets to support the 0.8mm thick pcb, during the SMT + reflow oven process. Process/QA see occurs: 1) 0402 unsolder? 2) 0402 tombstone? 3) "uBGA" poor-visual joints (dry joints)? Took
Electronics Forum | Thu Oct 14 18:02:31 EDT 1999 | JohnW
Bryan, 0402's tombstonning isn't that uncommon and usually the 1st reaction is alway's the pad size aint right. If you've followed the IPC guidline's normally you should be fine but I'd double check the component supplier's spec's as well. brian's p
Electronics Forum | Tue Sep 14 10:54:37 EDT 1999 | Scott Davies
| Can anyone out there pls enlighten me on how to solve chip tombstone defects. | I am running a board with a lot of 0603 chip. i had fine the profile and the alignment, but it still happen randomly on the board itself. Is there any other way to sol
Electronics Forum | Tue Aug 31 19:16:59 EDT 1999 | Steve Surtees
| I am looking for a rule of thumb regarding the maximum ramp standard components (chip capacitors) can tolerate without failure during the reflow process. The standard seems to be 3C\second, but this figure is generally derived from the average ram
Electronics Forum | Fri Jul 23 09:01:36 EDT 1999 | Earl Moon
| HI Earl | Thank you for your answer. | Let me know you about the hot you mentioned | First of all, The rework machine is the BGA3500 (manufactured by 0.k international:U.S.A) | ��DESOLDERING HEAT :OVER 200��(CENTIGRADE),30SEC(CHECKED
Electronics Forum | Wed Jul 14 13:22:51 EDT 1999 | kt
| I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it
Electronics Forum | Thu Jun 24 11:41:10 EDT 1999 | John Thorup
| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel
Electronics Forum | Thu Jun 10 15:46:56 EDT 1999 | Chrys Shea
| Does anyone out there involved in RF manufacture have any experience with the KIC Slim-Kic profiler? Do you find any interference problems between the RF transmissions and the testing of your products. We build primarily high-freq stuff like point-
