Electronics Forum | Fri Aug 04 15:45:27 EDT 2000 | John Thorup
Ditto to everything said. If everything in the process is correct you will have good success at 25 mil but it will take much care. I have done 20 mil on this type of printer but, as Steve says, I wouldn't want to on a daily basis. Those wipe-offs a
Electronics Forum | Mon Jul 17 20:20:53 EDT 2000 | Dave F
There is a wide range of price points and configurations for such equipment. RFA (Read the Fine Archives) and contact the suppliers (supplier lists are in SMTnet and "SMT" & "Circuits Assembly" etc magazines) and get back to us with specific question
Electronics Forum | Thu Jun 22 12:50:13 EDT 2000 | JAX
Igmar, Although I agree with Chrys that square is good,( Better volumn ) his explanation is not entirely correct. Heres a little insert from automata: With square apertures, solder paste is deposited at the center of the aperture. The center release
Electronics Forum | Thu Jun 22 12:06:10 EDT 2000 | Wolfgang Busko
Hi Sal, I assume your homeplates are designed with the peaks towards the componentcenter. I can imagine that due to placement inaccuracy not both sides sit in the same amount of paste and that wetting difficulties prevent same force factors for both
Electronics Forum | Mon Jun 12 06:45:10 EDT 2000 | kim ji tae
Hi! Thanks all who upgrade these pages. I have some questions. Is there any answer? I do double-sided reflow solderig, with 0.4% AG solder cream. with AU finished pcb. First I do reflow solder bottom side where 0.5pitch TQFP locates. Second I do re
Electronics Forum | Mon Jun 12 22:00:51 EDT 2000 | Dave F
Could be. What are your profiles? 2) Au finish fail => Could be, but that the connections can be made with hand soldering makes this a low probability cause, assuming the activity of the flux used in hand soldering is not significantly different fr
Electronics Forum | Tue May 23 09:01:21 EDT 2000 | Wirat S.
Dear all friend, I found problem of soldering bridging between SMT Chip terminal & Glue , but under the chip body. My process was double side SMT assembly with bottom side adhesive & heat curing, then wave soldering with water soluble flux (OS type)
Electronics Forum | Mon May 22 12:04:03 EDT 2000 | Michael Parker
80%. There are too many factors at hand to point the finger yet. We need to build a truth table and dot the i's and cross the t's before stepping up to Goliath (Samsung). Is you placement guranteed good? What x-ray have you used? Are your fab.'s know
Electronics Forum | Mon May 22 16:50:50 EDT 2000 | Kathy Palumbo
Mike, Is that greater than 80% yeilds, or less than? Here are the answers to your questions: Is you placement guranteed good? YES What x-ray have you used? Nicolet Are your fab.'s known good? YES Could you de-solder Samsung and replace with ano
Electronics Forum | Wed May 03 20:24:22 EDT 2000 | Dave F
MF: I know of nothing that addresses your question directly. Let me suggest: * Technical types at your solder supplier should be able to help. * "Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints" PL Tu, et a
