Electronics Forum: profil (Page 386 of 462)

Vapor soldering

Electronics Forum | Mon May 03 16:39:44 EDT 2010 | jlawson

Thanks Larry We are loooking a bigger Vapor > machine which could soldered our big size > borad(600x600 mm)assembled with hundreds of > sockets and thousands of components. How about > IBL products? Anyone used before? You should also look at

Vapor Phase Reflow

Electronics Forum | Fri May 07 23:43:10 EDT 2010 | jlawson

I assume you using a fixed mass vapour phase system? Yes rates of rise are impacted by the mass of the PCB, larger the mass to mass of vapour phase the lower the rise generally. So if you load the machine with very little mass PCB rise times can be

Reflow Oven

Electronics Forum | Fri Jul 02 10:30:35 EDT 2010 | kevslatvin

We used to use an APS Gold GF-120 before we went lead-free and the HT version came out. It worked fine for low volume and proto runs though not as much control over the profile as an oven with more zones. We actually had a batch oven from Bomir befor

Batch cleaner

Electronics Forum | Tue Sep 07 22:38:25 EDT 2010 | aqueous

As with so many things, some brands work very well on high density, low profile assemblies and some do not. Because my company manufactures these machines, I don't want to use this forum as an advertisement so I will recommend the following: 1. Sen

Flex Circuit Assembly Process (Sitiffeners)

Electronics Forum | Fri Oct 01 08:15:02 EDT 2010 | rgduval

Is the stiffener a piece of FR4, or a component that needs to be installed? We've done a number of flex assemblies taht have a rigid stiffener, generally a piece of rigid flex, or FR4 that has the components mounted on it. This type of stiffener

Pad finish

Electronics Forum | Thu Oct 07 08:13:52 EDT 2010 | remullis

I just swapped from the HASL to Immersion Silver mainly because the board house we use could not maintain consistency in keeping the pads level. I was constantly battling bumps and bad finishes on the pads. They are able to give me a consistent board

ENIG Solderability Issues

Electronics Forum | Thu Sep 30 16:28:51 EDT 2010 | 18424

Hello All, looking for some help from you guru's. I have several Enig boards with solderability problems. Components ranging from 0402's to ssop's. Using AIM W/S leaded solder paste, profile is beautiful and has been for years running the same produc

Crystalization on TI QFP and other fine pitch components

Electronics Forum | Thu Oct 28 11:50:11 EDT 2010 | phase1

We are having a little trouble with what appears to be a crystalization between our fine pitch parts. The problem appears after a a thourough wash of the pcb when dry. It looks like lead wiskers/haze between the joints.We are using water soluable lea

Fine Pitch Wave Soldering

Electronics Forum | Sat Mar 12 18:32:29 EST 2011 | jlawson

It is pretty hard to wave solder fine pitch parts bad enought with 0.5mm let alone 0.4mm It can be done but need N2 inert wave soldering & need layout design to accommodate this... Iy it is a QFP need to run part 45 deg into wave and if possible in

Solder beading with PCB from different fab

Electronics Forum | Wed Apr 06 04:18:03 EDT 2011 | emmanueldavid

TK, Hope you got it right only for this round of assemblies. Well, passing through a Reflow belt is not an ultimate process to dry circuit cards & take out moisture from Solder finished layers. First of all, if the packs were not unsealed (even s


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