Electronics Forum: profil (Page 416 of 462)

Re: Film Capacitors - Tombstoning or Drawbridging Problems

Electronics Forum | Mon Mar 30 07:44:12 EST 1998 | Earl Moon

| | | | | We are having some problems with "drawbridging" on 0805 film capacitors. | | | | We have already reduced the pad width from .050" to .040" based on input | | | | from vendor. Defects appear to be random as far as location on the PWB and d

Re: Double Reflow (Weight/Surface Area) Ratio Rule

Electronics Forum | Tue Mar 24 17:08:52 EST 1998 | Steve Gregory

David, There was a thread going on the IPC TechNet about exactly the same thing... The ratio that was posted is: Less than, or equal to 30-grams per square inch Which means if you weighed a part and it is 30-grams, you'll need .033" of surf

Re: Reflow Oven Evaluation Using Cpk

Electronics Forum | Thu Mar 19 13:30:49 EST 1998 | Earl Moon

| | | Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | | | 1

Re: Reflow Oven Evaluation Using Cpk

Electronics Forum | Thu Mar 19 13:41:43 EST 1998 | Justin Medernach

| | | | Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | | |

Re: Reflow Oven Evaluation Using Cpk

Electronics Forum | Thu Mar 19 13:53:07 EST 1998 | Earl Moon

| | | | | Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | |

Re: Entek coating

Electronics Forum | Wed Mar 11 11:05:06 EST 1998 | Earl Moon

| I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles mak

Re: Entek coating

Electronics Forum | Sun Mar 15 23:58:01 EST 1998 | Phill Hunter

| | I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles m

Re: Entek coating

Electronics Forum | Tue Mar 10 21:40:27 EST 1998 | Carl mitchell

| I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles mak

Re: Conformal Coating

Electronics Forum | Fri Mar 20 10:31:19 EST 1998 | Mick Jones

| I will be starting a conformal coating process soon, I am looking for any pointers on | 1) Best method for masking components, tape mask, liqued mask | 2) Which is best Spray or Dip? | 3) Compatiblity with no clean solder paste (flux residue) | I h

Re: Soldering to Paladium vs. Tin_Lead plated comps

Electronics Forum | Fri Feb 20 20:33:16 EST 1998 | Steve Gregory

The biggest difference between the two, is solder joint appearance. What I noticed mainly is that the solder does not wet and flow as readily to a palladium coated lead as it does with a tin/lead coated lead. When you look at a palladium coated lead


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