Electronics Forum: profil (Page 421 of 462)

Wow! Changes...

Electronics Forum | Thu Oct 17 11:36:09 EDT 2002 | bdoyle

I think I follow the questions... Ok lets see. About two site revisions ago there was a "home" page and there was a "MySMTnet" page. They were completely seperate entities. MySMTnet is a registered user customizable page. You dictate what boxes

SMT Component Design Requirements

Electronics Forum | Fri Oct 18 17:04:38 EDT 2002 | ereno

We have a connector mfg that claims that their design is good and does not contribute to the problem that we are having. The problem is evidence of poor soldering. All other components that surround this connector have very good solder joints, with t

Fine Pitch QFP100 Solder Joint - Need Help!

Electronics Forum | Wed Oct 30 02:37:58 EST 2002 | Dreamsniper

Hi Guys, I have a fine pitch QFP that I suspect of having a solderability (wetability) problem. The heel joint is 50%-75% of the lead thickness so it means that I passed the IPC Class 2 recommended criteria on the Heel. The toe has at least 25%-50% s

Air bubbles in solder joints

Electronics Forum | Wed Oct 30 16:05:08 EST 2002 | msimkin

Hi, I have received a report form a board supplier, analysing the reuslts form non wetting problems we have been expereincing with their boards. I assumed it was due to the gold layer being too thin, thus allowing the nicklel layer to be exposed and

Cleanliness test

Electronics Forum | Thu Jan 02 12:15:10 EST 2003 | Mike Konrad

Richard, With respect to the Resistivity of Solvent Extract (ROSE) test, the test solution is exceptionally aggressive. With the Zero-Ion for example, the test solution�s resistivity is 150 M-Ohms. Additionally, because test solution is made up of

Profile control parameters

Electronics Forum | Wed Jan 22 14:53:50 EST 2003 | MA/NY DDave

Hi I thought I would come back to this one for a second. Joe Fox above gave a nice concise note as to why you must raise the temp high enough above the soldering melting temp (liquidus) yet not too high. You want to go high enough for paste so tha

White residue after cleaning with IPA

Electronics Forum | Mon Jan 27 12:02:00 EST 2003 | Mike Konrad

Dave is correct. No-clean flux + water = white residue (unless the proper chemical is mixed with the water). Additionally, no-clean flux + IPA = white residue. Many saponifiers work well as do other cleaning agents. White residue may also be a re

First time with reflow oven....

Electronics Forum | Tue Feb 11 13:41:54 EST 2003 | Stephen

How are you doing things now? I'm trying to picture a place going from no reflow oven to a reflow oven without also getting a screen printer at the same time. Are you now handsoldering parts on? With these batchs you plan on doing are you going to

Epoxied Parts Falling Off

Electronics Forum | Mon Mar 03 19:50:25 EST 2003 | ruggi

Hi, We dealt with and solved this problem here at Agilent...We have been doing simultaneous reflow cure in convection reflow ovens for all of the 9 years I've been here with minor problems of chips falling off, and after switching to Loctite 3609 th

AOI, Pre or Post Reflow?

Electronics Forum | Mon Mar 10 10:14:10 EST 2003 | pjc

Most pre-reflow AOI systems today can easily keep up with production line beat rates. Pre or Post reflow AOI is the difference between process control vs. defect screening, in my opinion. Pre reflow repairs cost much less than post. Pre AOI is for


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