Electronics Forum | Tue Dec 07 21:28:00 EST 1999 | sosina outry
I had read all three reply to the interval of pcb in the reflow process already. Like Wolfgang said, base on the profiling and the temp that you set in there. The interval will be base on that temp. Some might have a gap of one pcb lenght, some mig
Electronics Forum | Wed Aug 18 16:26:21 EDT 1999 | Tony
Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. This is what I did. Created a removal profile, I had a board
Electronics Forum | Thu Nov 05 17:39:21 EST 1998 | Dave F
| Is there anyone who can help me with the average profile to start and speed of the above-mentionned oven ? Have you used the blower at any other setting than 100% use? | Barbe: The first pass at setting your profile should be based on: 1 Sol
Electronics Forum | Mon Jun 29 14:36:01 EDT 1998 | Claudio Carnevali
We are an italian electronic company and we assembly th & smd (http:\\www.mobilia.it\egs). We know that you need a thermal profiler but without sopending a fortune. We made TOM300 and easy & powerful profiler that you can buy at about 1,600 USD compl
Electronics Forum | Mon Nov 05 04:59:59 EST 2001 | madreindeer
hi, I have found dull joint when I have done trial if boards and cooling too fast.Also with Nitrogen.Some of paste don�t like Nitrogen too much. Also I have seen this when profile is not hot enough or flux haven�t survived to liquidus point. I wou
Electronics Forum | Tue Apr 09 00:09:25 EDT 2002 | craigj
Question. When profiling and looking at the profiles cooling rate. Over what temperature range should the slope be monitored and what sort of cooling rates should be looked for. Paste supplier says no more than 6degC per sec, some components maybe lo
Electronics Forum | Sun Apr 21 09:34:03 EDT 2002 | hany_khoga
Dear all: We need to glue some chip capacitors (0603 & 0805) before continuing the process of placing the topside SMT components. As a subcontractor we received the whole materials including the glue. After experimenting several temperature profiles
Electronics Forum | Wed Sep 25 10:56:27 EDT 2002 | xrayhipp
Yeah, perhaps lean more towards a ramp-to-spike profile - reducing the soak time and add a littel heat to your temp above liquid. This has worked for us with water soluable paste as we are not required to use no-clean and utilizing a 6-zone oven. G
Electronics Forum | Tue Jan 13 01:20:31 EST 2004 | mantis
Hi All, I have seen this issue on a QFP160.Firts of all as previously suggested if the board is wave solderded make sure that you are not seeing topside reflow as the board goes over the wave.Secondly you should verify your reflow profile.I seen this
Electronics Forum | Sat May 08 13:56:27 EDT 2004 | Ken
If this is a requrement from your customer then: They should supply the name/brand of the material, AND they must supply solder samples because their requiremnt is a destructive profiling technique. You should charge them more dollars for setup and
