Electronics Forum | Mon Oct 09 13:41:20 EDT 2017 | dleeper
developing a reflow profile is about balancing two variables, time and temperature. If its too hot, you damage parts, if its too cold, the solder won't melt. If the belt speed (time) is to rapid your temperatures will ramp to fast, if its too slow, y
Electronics Forum | Thu Sep 05 11:05:35 EDT 2019 | SMTA-Tony
There are competitors to REL solder alloys from AIM. Tin-Copper-Nickel-Bismuth alloys (Nihon Superior) are an alternative option which do very well in thermal cycle testing. The reflow profiles required are similar to SAC305 profiles. You may als
Electronics Forum | Fri Aug 24 12:17:01 EDT 2018 | spoiltforchoice
To my mind, the solder paste has clearly melted, but your HASL plating has not. This with your profile seems to suggest there's something a little weird about your PCB. However, there are probably still questions we could ask - have you successfully
Electronics Forum | Thu Jun 06 15:18:56 EDT 2019 | gregoryyork
Honestly, If I ever have an SMT problem it's when a profile is at 230-235C. We encourage minimum 240C and typically 245-250C. Many components call for 260C. Some Paste manufacturers advocated 230C in the early years of Lead Free and it was a disaster
Electronics Forum | Mon Jul 01 09:33:08 EDT 2019 | dbuschel
if you can't change the PCB materials or design at this point, you might be able to reduce it somewhat through the use of fixtures or edge stiffeners. Unless it is a particularly thick board, I don't think the reflow profile would be the issue. The t
Electronics Forum | Fri Dec 27 13:16:18 EST 2019 | slthomas
Can you describe the failure mode of the soldering defect, i.e., is it failing to meet the height requirement for a castellated termination due to not wetting of the component terminations, or not wetting the pads sufficiently, or....? We install a
Electronics Forum | Mon Feb 03 16:30:47 EST 2020 | dontfeedphils
Reason I ask is because I've never really paid much attention to the cooling rate, but I'm currently running a 10 zone oven and using all 10 zones for heating whereas I've almost always used a 10 zone as 9 heating and the last as a cooling. I'm curr
Electronics Forum | Wed Apr 22 20:55:04 EDT 2020 | SMTA-Samy
The ideal cooling zone curve should be a mirror image of the reflow zone curve. The more closely this curve mimics the reverse of the reflow curve, the tighter the grain structure of the solder joint will be upon reaching its solid state, yielding a
Electronics Forum | Tue Feb 11 09:26:57 EST 2020 | astarotf
Hi everyone I have problems welding QFN components in a 10-zone reflux oven, we cannot make a welding fillet that covers the entire QFN pin. Currently we use paste T4 - 63Sn / 37Pb. I enclose the curve of the oven profile. Any help or support on this
Electronics Forum | Tue Feb 18 06:14:53 EST 2020 | astarotf
Evtimov SMTA-Alex Hi After the comments, we have analyzed our oven curve according to our sheet of technical data of solder paste. We modify the curve taking the linearity to the maximum with what the file specifies, we attach the profile and the c
