Electronics Forum | Wed Sep 13 10:31:14 EDT 2006 | CL
Hello Brad, We are running the Slim Kic 2000. We have found the predictions to be fairly accurate as long as the suggested change is within 20 degrees of the original recipie. As a test I ran a board with the wrong profile. The predictions got me wi
Electronics Forum | Thu Jan 11 00:52:12 EST 2007 | behrsam
Mario, I tried a couple of profiles. In all cases the preheat ramps fairly slow, while the reflow utilizes the radiative heater to speed to reflow as quick as possible. I tried a quick profile and a slower one. The quick has about 15-20 sec at pre
Electronics Forum | Tue Dec 24 11:01:19 EST 2013 | davef
I wouldn't get too tightly wrapped around the axial of paste suppliers recommendations of thermal recipes. Said another way, "Do not count on the solder paste representatives for good technical advice--they are the ones who came up with these "'TIME
Electronics Forum | Tue Jun 25 12:10:10 EDT 2019 | slthomas
The profile (temperature curve) is absolutely a function of both top and bottom zone settings as well as conveyor speed, blower speed, etc.. Certainly when you perform profiling you have to consider both top and bottom heaters when you make adjust
Electronics Forum | Wed Feb 09 22:08:45 EST 2000 | Dave F
Russ: You've got stop soft-peddling this stuff. This doesn't sound like "poor solderability." It sounds like "no solderability." It also sounds like you�re dead meat. Three places to call: 1 Board supplier to get their suggestions on unsolderab
Electronics Forum | Sat Jun 17 09:09:15 EDT 2000 | Chrys Shea
Contact the adhesive manufacturer, or their website. Most adhesive suppliers offer two cure options - one with a belt oven profile and one with a box oven profile. The belt oven is usually a ramp and plateau of 120-150C for approx 2 minutes. The b
Electronics Forum | Tue Apr 18 19:37:35 EDT 2000 | Russ Cutler
Let me be more specific about my dilema. We have used a vapor phase reflow process for many years. We just bought a Heller 1800 this year (2000). We may very well be able to run all 600 very different board types we build in 10 recipies on the Hel
Electronics Forum | Fri May 18 13:30:52 EDT 2001 | mparker
I will start with the statement that I think it is great that we have the ability to solder SMT components that emulates wave soldered components. With that in mind, I would want to find acceptance criteria to be similiar, regardless of the solder me
Electronics Forum | Wed Jul 11 13:41:37 EDT 2001 | procon
Hi Chris, Dave F is absolutely correct in his assunption that the leads are hotter than the pads. You must profile from the pads to see the exact temperature that they are reaching. If the entire board reflows properly as you described, don't get ca
Electronics Forum | Mon Jul 23 12:12:57 EDT 2001 | kennyhktan
Good day! As we all know the normal recommended solder paste(Sn62/Pb37) reflow profile time is around 40~60sec above the temperature of melting point. Now I'm setting my peak temperature at the high site of solder paste recommended spec. due to metal
