Electronics Forum | Fri Jan 30 04:10:10 EST 2009 | sachu_70
Hey Daniel, N2 gas provides an inert atmosphere which help to minimise oxidation, generally a concern across the reflow zone. Although N2 provides a more shiny solder joint, it is certainly more of a cosmetic issue and does not certify joint reliabil
Electronics Forum | Mon Feb 12 13:58:10 EST 2007 | campos
Tks for the answers,, My concern is about the intermetalic layer,,I run SMQ230 LEAD FREE paste.. its liquidous at 217C..the oven have 7 zone, but I run in 5 zones also with a more agressive profile (due to the line rate)..I would like to know if runn
Electronics Forum | Thu Aug 19 12:35:27 EDT 2004 | rlackey
Hi Snehal, Here are some considerations for you: Will you be doing Lead free soldering in the near future? What level of throughput are you looking for - are you high volume, medium or low volume? What is the support network like in your area? W
Electronics Forum | Sun Feb 18 16:47:34 EST 2007 | darby
As I stated, the reply was direct from Indium, (thanks to Rich Brooks). The information regarding cool down rates should come from your paste supplier; not an oven supplier; not a generic article on lead free. I just went through the data sheets from
Electronics Forum | Thu Jun 09 19:09:37 EDT 2005 | Kantesh Doss
We verify oven profiling once a week on a scrap board and enter the data in a SPC Chart. This works out great and I have not noticed any problem. I also like the idea of sending the Profiler through the oven with the thermocouple sticking out to meas
Electronics Forum | Fri Jun 03 10:15:14 EDT 2005 | PWH
We do both our ovens once a week. If something looks out of tolerance (we've developed acceptable tolderances based on many recorded profiles over time and oven mfg. specs.) we wait a couple hours and try again. The recorded data over time is very
Electronics Forum | Fri Jun 03 09:00:06 EDT 2005 | russ
How many times have you found that your oven was performing differently? this will give you the answer on frequency. We have a dedicated board and profile that we use to verify the oven operation. We perform this every 3 mos. and I believe that th
Electronics Forum | Fri Jun 03 04:16:27 EDT 2005 | Bryan She
Background: We use a thermal boards to setup/profiling the reflow oven for pilot run.and then daily verify the reflow profile with this thermal board.Now we phased into LF production,and the LF thermal board can only withstand 25~30 times reflow excu
Electronics Forum | Fri May 23 14:39:00 EDT 2003 | bradlanger
Cameron, I am burying the thermocouple in high temp solder on the solder pad of the area I want to profile.