Electronics Forum | Fri Jan 24 09:52:08 EST 2014 | davem
Hi Guys, So I work for a small contract manufacturer which caters mainly to the defense sector. As such, our customers haven't (yet) had a great need to incorporate 01005's into their designs. Looking forward, we decided to "take the plunge" and dia
Electronics Forum | Wed Dec 13 14:15:54 EST 2000 | Chris
I have a product where an IC is soldered using a stencil which puts down way too much paste. The result is massive bridging. Anyway, one of my coworkers claimed he could eliminate the bridging by baking the circuit board in an oven for 5 min at 90
Electronics Forum | Tue Aug 31 19:16:59 EDT 1999 | Steve Surtees
| I am looking for a rule of thumb regarding the maximum ramp standard components (chip capacitors) can tolerate without failure during the reflow process. The standard seems to be 3C\second, but this figure is generally derived from the average ram
Electronics Forum | Wed Sep 05 14:51:47 EDT 2001 | gdstanton
Well, it appears after running both a bare and populated PWB we were seeing flux exhaustion on the uBGA. The problem apparently resulted by a recent maintenance effort where the air blowers in the reflow oven were replaced. The blower replacement m
Electronics Forum | Wed May 22 05:10:45 EDT 2002 | johnw
Ron, The new ystem is probably the best one I've seen for useability, the who thing can be driven by wizards to guide people through what they need to do. The system has the ability to set alarm's that will basically analyse your result's for you an
Electronics Forum | Mon Aug 19 16:57:38 EDT 2002 | dragonslayr
Individual process steps are approximately the same length of time for reworking a BGA. You seem to be comparing the use of the automated SMT line versus an off line rework station. Consider that the off line station is a complete paste print, pick
Electronics Forum | Thu Jun 26 04:34:49 EDT 2003 | emeto
Hi James, I saw very good posts here.Now I will give you one more practical way: 1. My advice is to encrease the temperature(like your first sidgestion). Termostress is important thing so your first zone should be 120-150C. 2. The paste profile. If
Electronics Forum | Thu May 18 08:31:28 EDT 2006 | marc
Hi James Short answer... yes... long answer...impingement velocity is excellent for heat transfer but it also is a higher risk of moving components. Variable speed blowers allow you to reduce the speed / impingment and more than likly your compone
Electronics Forum | Tue Nov 20 09:50:07 EST 2007 | rgduval
Only on the bottom side? Run that side first . We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend
Electronics Forum | Fri May 29 08:25:13 EDT 2009 | floydf
We are getting what looks like cold solder joints on one of our boards. The boards have an aluminum substrate, and use OSP plating. The solder is lead free - 96.5 Sn, 3.0 Ag, .5 Cu. The flux is no clean. When we first had the problem, my solder profi
