Electronics Forum | Mon Aug 26 20:33:50 EDT 2002 | davef
Not as such. Generally, people tailor their profiles to produce glam solder connections on their boards. Search the fine SMTnet Archives for discussion on the factors affecting solder reflow recipes. What is the best way to get these PCB made to s
Electronics Forum | Wed Aug 28 18:08:07 EDT 2002 | MikeF
This looks like it may be a good application for an Air-Vac or Wenesco type solder station. It is a solder pot that has a small motor to pump solder up through a chimney. You can put different nozzles on the top of the chimney, so you only apply sold
Electronics Forum | Thu Apr 24 12:18:01 EDT 2014 | cyber_wolf
You must thermally profile your circuit boards with a data-logger and thermocouples. Just putting in oven set points and looking at solder joints is not enough. Reference IPC-7530
Electronics Forum | Fri Apr 18 11:05:47 EDT 2014 | horchak
First things first. Check the manufactures specs on the electrolytic caps as they may not be able to handle the lead free temps.
Electronics Forum | Wed Apr 23 09:38:05 EDT 2014 | rgduval
Get in touch with your paste manufacturer. They should have a data base of different oven types/zones, and can give you "baseline" settings for a medium thermal density board that has been proven to work well with their paste. After that, it sounds
Electronics Forum | Thu Apr 17 17:57:13 EDT 2014 | proy
Hello We use a 5 zone conceptronics HVN70 and never before have we had something we could not do including 6 layers Rohs complicated boards. Recently we had a larger - simple 2 layer board - all 1206's etc however there are 15 pcs of a LARGE high m
Electronics Forum | Tue Feb 19 12:28:26 EST 2019 | slthomas
Presumably you're talking about lead free, but you don't say. Heller can probably provide you with a starting point, as rob has already pointed out, but you do need to develop the capability to perform profiling yourself. That oven should have ECD
Electronics Forum | Sun Apr 25 09:45:13 EDT 1999 | Joe Cameron
Hello all, Our guys here still have some questions on the "optimized" profile which sees a more moderate ramp up straight to reflow temperatures versus the conventional profile which has a plateau at around 150 Celsius. If the optimized profile can
Electronics Forum | Sat Sep 22 09:07:56 EDT 2001 | davef
Back-stepping a bit. If a profile is being used to: * Set-up the oven for a new product or trouble-shooting process, the profile should be taken with a solid contact to a solder connection. * Monitoring on-going stable and in-control process that re
Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony
I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde
