Electronics Forum: profile hp (Page 1 of 2)

5 zone oven profile

Electronics Forum | Tue Apr 05 15:32:49 EDT 2011 | grahamcooper22

It is one of our pastes...Almit LFM48 W TM-HP, a high reliability no clean solder paste based on SAC305 with a size 4 powder. It's a paste that works so well we have thousands of users of it worldwide. Why are you using SN100C alloy paste ? I imagin

BGA Reflow profiles

Electronics Forum | Sun May 17 00:41:17 EDT 2009 | microdot

hi, I am sorry if i sound offended anybody. What i meant is that we are handling boards which are from major manufacturers like hp / compaq / dell / ibm / intel. So if annybody has experience of handling it..than they may have reflow profiles of sa

Re: IP1 for Placement of BGA's?

Electronics Forum | Sun May 30 15:11:10 EDT 1999 | M Cox

Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but accordin

Re: IP1 for Placement of BGA's?

Electronics Forum | Sun May 30 18:34:04 EDT 1999 | Earl Moon

Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but accord

Re: IP1 for Placement of BGA's?

Electronics Forum | Sun May 30 12:33:36 EDT 1999 | Earl Moon

Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but according

Re: BGA voids

Electronics Forum | Wed Jan 19 00:42:09 EST 2000 | park kyung sam

In my case, when i solderd the bga in normal reflow(convection hot air). There is a lot of boid. i had tried to reduce void long time. so i reduced just a little. It did't satisfied me but now i cannot looking for the void in soldered bga i

Noclean soldering to gold

Electronics Forum | Fri Dec 03 19:44:34 EST 1999 | Russ

Hello all, I am in the process of converting our facility to noclean processes. So far I am experiencing troubles with soldering to gold finishes. The finish is an H.P. type1. The solder joints appear dull and grainy. They seem to be very strong

Lead Free Solder Paste Evaluation

Electronics Forum | Wed Apr 08 07:16:21 EDT 2009 | arrowvale

We have just switched to Almit (www.almit.com)LFM48 W TM-HP-S lead free solder paste. In general terms it is an easy printing paste, with great slump properties, wide reflow process window and offers excellent solderability on all pcb / component pa

Re: X-Ray for CSP devices

Electronics Forum | Thu Jul 15 11:01:06 EDT 1999 | Earl Moon

Hello All, I am setting up a line to mount CSP/uBGA devices and now am looking at the X-Ray process. It is my opinion that this should be done offline - can you tell me if Im right or do I need to put one inline? Also anyone who is mou

Re: IP1 for Placement of BGA's?

Electronics Forum | Sun May 30 11:43:23 EDT 1999 | M Cox

Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but according to

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