Electronics Forum | Sun Jun 06 11:01:36 EDT 2004 | adm
Hi I'm trying to plot a LSP profile to reduce void. But I do not have much info about LSP. Does anyone know what are the specific times and temperature of the LSP profile? And are there any ways to eliminate solder void other than changing profile
Electronics Forum | Sun Jun 06 11:02:33 EDT 2004 | adm
Hi I'm trying to plot a LSP profile to reduce void. But I do not have much info about LSP. Does anyone know what are the specific times and temperature of the LSP profile? And are there any ways to eliminate solder void other than changing profile
Electronics Forum | Sat Nov 25 21:18:03 EST 2006 | callckq
Dear all, I would like to learn from all regarding purpose of each profile stages, such as preheat, soak, peak cooling. At what stages, flux start to be activated? Thanks for your time,
Electronics Forum | Fri Aug 21 04:37:26 EDT 2009 | grahamcooper22
Manufacturers of non hermetic SMT components have to test their devices as per IPC JEDEC 20C to check their reflow and moisture sensitivity. In this spec they pass them through reflow 3 times, then check them for damage and retest their performance.
Electronics Forum | Wed Jan 25 07:18:03 EST 2017 | emeto
If you prefer to use same profile - it will be fine most of the time. There are several things to consider. 1. Is there part on second side that cannot withstand temperatures from first side? 2. If there is a high mass component on first side, that
Electronics Forum | Sat Oct 01 01:25:30 EDT 2005 | ck
Sorry theres a mistake on previous question. It should be lead free component termination but non lead free solder alloy Sn63/Pb37. The reflow profile i am using : Soaking temp. 120 to 160 deg C; time 90 to 120 sec. Peak temp. 215 to 225 deg C; time
Electronics Forum | Sun Apr 25 12:24:45 EDT 1999 | Chrys Shea
| Hello all, | | Our guys here still have some questions on the "optimized" profile which sees a more moderate ramp up straight to reflow temperatures versus the conventional profile which has a plateau at around 150 Celsius. If the optimized profi
Electronics Forum | Sun Apr 25 14:43:34 EDT 1999 | Earl Moon
| | Hello all, | | | | Our guys here still have some questions on the "optimized" profile which sees a more moderate ramp up straight to reflow temperatures versus the conventional profile which has a plateau at around 150 Celsius. If the optimized
Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
Electronics Forum | Wed May 12 08:16:33 EDT 2004 | solderpro
woow, slow down hot rod, hey davef, you are alright by me, good to see some one out there that has hands on experience rather than a theory nut.... any how, you need a top of the line profiler, super gold mole, or Kic.... these truly are the best and
