Electronics Forum | Wed Oct 09 19:08:37 EDT 2002 | russ
AJ, I have bought and used 2 DRS24's in the past. It is a good machine. (I don't think that I will bring up the fact that a certain package that I had kept shorting so I sent them a couple to help with the profile and all of them came back shorted
Electronics Forum | Sat Oct 19 08:14:27 EDT 2002 | johnw
The world of the CM isn't alway's a happy one and the problem is that some one else is alway's paying your wages, that soemone else beign the customer so you really have to do what they say. The board profilign one is a constant one round our place a
Electronics Forum | Wed Jun 25 18:17:48 EDT 2003 | Brian W.
Water soluble pastes generally work best with a ramp-to-spike reflow profile. Check your paste manufacturer's recommended profile. There are many factors that impact your profile; board thickness, component density, buried thermal masses, board si
Electronics Forum | Thu Jan 29 00:10:17 EST 2004 | Vinny
Hi Dave, Thanks for your reply. I have tried getting the design changed from the customer but they cannot provide thermal relief as this changes the RF performance and they cannot afford to do that. As for profile it does reach the reflow tempera
Electronics Forum | Tue Feb 17 17:55:38 EST 2004 | bman
I might be saying something that will get me laughed off of SMTnet forever, but when faced with a similar problem here's what I did. Since I was removing parts I didn't see why I would be concerned about all the things that go on in a good temperatu
Electronics Forum | Thu Mar 04 12:34:48 EST 2004 | cyber_wolf
I know that many smaller companies clean their stencils the same way you do. If you get good results cleaning your stencils this way then I would say stick with the alcohol/wipe method. Take your stencil and put it under a microscope.If the aperture
Electronics Forum | Wed Mar 24 15:48:33 EST 2004 | davef
KIC Thermal Profiling did a DOE [Nepcon West 1999] [you probably can find it posted on their site] on thermocouple attach. Comparing the reliability and repeatability of thermocouple attachment methods: * High temperature solder was found to be the
Electronics Forum | Fri Mar 19 07:24:29 EST 2004 | pjc
Before "Pb-Free" became an issue we were and still are using Pb-Free component lead finishes- such as on many TSOP, SSOP and QFP packages as well as caps. Components manufacturers changing the lead finish to no-Pb tend to ensure solderability with Sn
Electronics Forum | Tue Apr 13 13:01:01 EDT 2004 | arcandspark
These voids only appear in the solder connections that have a (via in pad). The pads that do not have (via in pad) do not have any voids. Profile is 60 seconds above 183 C and peak of 218 C. The BGA is an OMAP lead free,I am using standard eutectic s
Electronics Forum | Thu Apr 15 11:53:37 EDT 2004 | Claude_Couture
Hi everyone, Our QC manager is bugging me about calibrating the TC readings on our reflow ovens. I keep telling him that doing a regular reflow profiling with a mole is sufficient to see if the oven temperature are normal. The manuals state that TC c