Electronics Forum | Fri Sep 07 16:53:37 EDT 2012 | burb1999
We have Heller, 1707EXL now. It has a removable support for the mesh conveyor that just pull out (clipped in). Had an Electrovert and they were bolted on and very tuff to change out. The oilers Im not sure I care for though,they have a metal rail t
Electronics Forum | Mon Sep 17 03:59:52 EDT 2012 | stivais
Hi guys, We have an interesting case we haven't seen before (see the picture below) http://postimage.org/image/lu2f4ae55/ Solder balls form on unpopulated pads after reflow. 1. Reflow profile is fine. 2. Stencil thickness / paste volume is also f
Electronics Forum | Wed Oct 03 19:28:58 EDT 2012 | rgduval
Given that you're seeing it on nearly every part, we tend to lean towards Dave's explanation. We wouldn't expect outgassing from the pad to be an issue (at least, we've never heard of it before, which doesn't, necessarily, eliminate it as a potentia
Electronics Forum | Thu Oct 25 13:33:18 EDT 2012 | cyber_wolf
Ken, The photo looks like results I have seen because the gold flash was too thick on the board. This causes a condition known as gold imbrittlement. You may want to get an analysis of the plating thickness. I'm not real experienced with immersion si
Electronics Forum | Wed Sep 26 11:17:38 EDT 2012 | garym4569
We have been having a solder paste reflow issue which results in the solder not wetting to the LED lead. The solder appears to create "puddles" on the pcb pad. I have attached AOI image for review. We have had the pads analyzed for contamination, w
Electronics Forum | Thu Oct 04 10:54:11 EDT 2012 | eniac
I have only one incredible idea: this is example of different speed of heat transfer of neighboring pads. I saw it two times during last years, but on lead solder pastes (Sn63Pb37). The reason of this mistakes each times we found two: 1. errors duri
Electronics Forum | Fri Jan 18 12:34:14 EST 2013 | duchoang
Yes, I have. think I have pretty good reflow profile. We use Lead-Free,No-Clean,SAC305 Solder Paste. The problem is at LGA design.The pad size is alot bigger than BGA. They are totally flat and do not have balls/spheres which melted and collapsed thr
Electronics Forum | Tue Feb 05 16:06:48 EST 2013 | mlevesque
We are looking for a new BGA rework station. We got an ERSA IR550A and we are not very satisfied. I'm not sure that IR reflow is the better solution because the top-side heating is too large. I think is better with a convection "forced-air" heat.
Electronics Forum | Tue Feb 05 20:31:39 EST 2013 | hegemon
Air Vac DRS25. Hands down the best rework EQ. (my humble opinion, based on my own experience with rework EQ going back 15 years +) Right in your budget. Complete capability for rework. SMD, BGA, POP. Full profiling capability. Massive bottom heati
Electronics Forum | Fri Feb 22 18:36:36 EST 2013 | austinpeterman
Has anyone experienced bridging on topside (solder destination side) surface mount devices after wave soldering? We x-rayed 100% of the placements after smt re-flow with no issues. When the same placements were x-rayed after the tht wave solder pro
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