Electronics Forum | Mon Aug 14 03:25:51 EDT 2017 | spoiltforchoice
There is no solution in above case, this is > caused by the PCB design. There are no > thermals on the pads connected to the copper > poured area. So the other pad reflow first and > lift the component. Yes, this. You could try playing with
Electronics Forum | Thu Aug 24 00:05:14 EDT 2017 | heros_electronics
The first reply from Tsvetan Usunov already > answered your question - there are no thermals > for one side of the chips. > > You can try to > reduce the phenomenon by using different solder > pastes, tuning your soldering profile or even > swi
Electronics Forum | Sat Aug 12 11:55:52 EDT 2017 | sankarseptember
We are facing component Drop on second side of the reflow.We are using Senju Reflow oven..Profile judgement was within in the standard.All the component Drop occur in between last heating zone and cooling Zone.The dropped component is ICC 525FL5 SOP
Electronics Forum | Wed Feb 14 16:44:01 EST 2018 | cbart
Probably to late for ya, but: -Center support -mesh belt and conveyor (have the mesh is nice for 1st side runs to keep the board flat. -N2 capable, in case you need it -on board profiling -smema if needed -board drop detect (sensor at input and exit)
Electronics Forum | Thu Mar 08 07:24:40 EST 2018 | proceng1
That's what I said when we started talking about 48inch boards. Everything changes. New printer, bigger stencils, new pick & place. Different even profiling (the board is in 3 zones at the same time). Plus board racks don't work well. The old Boa
Electronics Forum | Mon Nov 13 14:58:56 EST 2017 | davef
Determine the origin of the solder * Sloppy paste printing technique * Lax stencil underside cleaning practices * Sloppy misprint cleaning practices * Poor part placement practices creating solder balls * Poor material control allowing solder p
Electronics Forum | Mon Mar 26 19:22:22 EDT 2018 | tey422
First of all, shouldn't allow SMT operators to edit/create recipes, only grant access to the well-trained only. You will put yourself at risk if you don't have good process rule of oven recipes. Newer oven models should come with software that has m
Electronics Forum | Tue Mar 20 04:40:15 EDT 2018 | rob
I've seen them down at 2 metres in the past, but usually only 4 zone. from memory Electrovert used to do a small 5 zone with pin chain - Infraflow 500 or something. To be fair, even small one line CEMs usually have a decent oven as you need to be a
Electronics Forum | Sun Mar 25 08:45:00 EDT 2018 | jacobidiego
Normally some random components of size 0604 or below and may be due to a thermal mass being close like a transformer or AC electrolytic caps. We tried changing fan speed, but this will change the thermal profile and avoid the thermal mass from bein
Electronics Forum | Thu Jul 26 04:26:59 EDT 2018 | Robl
Hi VChauhan, I'll preface this by saying I am no DaveF. Voiding can occur when the flux in the paste boils and vapourises, the expanding vapour needing somewhere to go displaces the paste. So... what we have done in the past: 1) Step the stencil d
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