Electronics Forum: profiler (Page 346 of 462)

OK, now I think I've got it......

Electronics Forum | Fri Aug 18 12:35:11 EDT 2000 | Steve Thomas

Thanks for all your replies, folks. yes, I've read Chry's detailed description more than once (I too wish I could SEE it done rather than read about it), but even in following it I ran into problems. I was making it much more difficult on myself th

Re: Lowering Nitrogen Levels to burn off flux residue

Electronics Forum | Sat Aug 12 09:47:36 EDT 2000 | Dave F

GJ: If your supplier uses a conformal coating that "must be applied to a clean surface," then you are using the wrong supplier and no amount of twiddling with your N2 levels will change this. NC fluxes are inherently "dirty" and nothing aside of cle

Re: MultiCore Brand

Electronics Forum | Fri Aug 11 08:52:11 EDT 2000 | vickij

Kyle: I have also used the Kester, and the biggest difference I found between the two is that the MultiCore is a lot thicker. I had to make some printer adjustments to use the Kester; I had to use a little less squeege pressure to get a clean print

Re: solder balling

Electronics Forum | Thu Aug 10 03:30:42 EDT 2000 | JohnW

Ramon, Solder ball' are a bitch aint they?, identifying the right location to fix em is a bigger one. As you and the rest of teh guy's have said yes you'll need to look at your stenil..but maybe your stencil is good so you'll need to look else where

Re: Clamshell printers

Electronics Forum | Fri Aug 04 15:45:27 EDT 2000 | John Thorup

Ditto to everything said. If everything in the process is correct you will have good success at 25 mil but it will take much care. I have done 20 mil on this type of printer but, as Steve says, I wouldn't want to on a daily basis. Those wipe-offs a

Re: Help for choice

Electronics Forum | Mon Jul 17 20:20:53 EDT 2000 | Dave F

There is a wide range of price points and configurations for such equipment. RFA (Read the Fine Archives) and contact the suppliers (supplier lists are in SMTnet and "SMT" & "Circuits Assembly" etc magazines) and get back to us with specific question

Re: Aperture size for Micro BGA stencil

Electronics Forum | Thu Jun 22 12:50:13 EDT 2000 | JAX

Igmar, Although I agree with Chrys that square is good,( Better volumn ) his explanation is not entirely correct. Heres a little insert from automata: With square apertures, solder paste is deposited at the center of the aperture. The center release

Re: Skewing chip components

Electronics Forum | Thu Jun 22 12:06:10 EDT 2000 | Wolfgang Busko

Hi Sal, I assume your homeplates are designed with the peaks towards the componentcenter. I can imagine that due to placement inaccuracy not both sides sit in the same amount of paste and that wetting difficulties prevent same force factors for both

solder joint problem?

Electronics Forum | Mon Jun 12 06:45:10 EDT 2000 | kim ji tae

Hi! Thanks all who upgrade these pages. I have some questions. Is there any answer? I do double-sided reflow solderig, with 0.4% AG solder cream. with AU finished pcb. First I do reflow solder bottom side where 0.5pitch TQFP locates. Second I do re

Re: solder joint problem?

Electronics Forum | Mon Jun 12 22:00:51 EDT 2000 | Dave F

Could be. What are your profiles? 2) Au finish fail => Could be, but that the connections can be made with hand soldering makes this a low probability cause, assuming the activity of the flux used in hand soldering is not significantly different fr


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