Electronics Forum | Tue Jul 24 20:00:40 EDT 2001 | davef
There is too little heat to make the solder flow properly. Test this theory by profiling on the pad where the solder doesn�t flow well. As the time after posting this thread increases, we generally propose additional theories. Rather than us specu
Electronics Forum | Fri Feb 04 11:26:58 EST 2000 | Lisa Anderson
We are currently using an Air-Vac DRS24 hot air BGA/SMD rework unit. Most of our nozzles are designed to channel the exhaust away from nearby components. This and a minimum keepout of .100" has prevented any issues with secondary reflow of those co
Electronics Forum | Fri Jul 23 01:03:28 EDT 1999 | KYUNG SAM PARK
HI Earl Thank you for your answer. Let me know you about the hot you mentioned First of all, The rework machine is the BGA3500 manufactured by 0.k international ] ��DESOLDERING HEAT ��IRON TIP TEMP : 350-370��(MEASURED) ��REBALLING
Electronics Forum | Tue Jun 08 05:02:09 EDT 1999 | Charlie Thornton
Can anyone please help me locate details on maximum allowable temperatures of components when passing through a reflow oven. I think I want the thermal profile for the part, or a source or standard which will allow me to check if I can safely reflo
Electronics Forum | Wed Feb 24 11:05:13 EST 1999 | justin medernach
| I am profiling a BGA for the first time and I am seeing temperature flucuations on the ramp and cool down from the thermocouple I have placed through the pcb and under the component. I am using a 5 zone convection oven.Any suggestions on the plobl
Electronics Forum | Mon Feb 01 18:08:10 EST 1999 | Susan
Hello Everybody: I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. We are witnessing dull solder joints afte
Electronics Forum | Sun Nov 29 21:14:22 EST 1998 | Erhan Kaya
Hi Terry, I do the same thing Chris is suggesting. I am not sure about the company who made the thermocouples I use but most probably it's the same. I'll let you know if they're different so that you'll have an alternative source. I also agree with
Electronics Forum | Fri May 22 19:21:48 EDT 1998 | Dave F
Recently there was a thread on soldering paladium leads on ICs. A gent from TI suggested an article he had written. Various folks suggested making sure the reflow profile peaked above 215C. My question is: How does one recognize paladium leads so
Electronics Forum | Mon Aug 13 21:04:15 EDT 2001 | davef
What??? You don�t have enough things to monitor? The origin of some profiles is mysterious. It�s probably good to try to understand such mysteries. Certainly, the important determinants in the design of your reflow profile are: * Paste you�ve sel
Electronics Forum | Fri Sep 21 09:29:49 EDT 2001 | steven
when taking a reflow profile, can i attach the thermalcouple to the component body (using high temp tape) instead of to the leads (often found thermal couple dettached during reflow). in general, what is the temp diff between these 2 locatinos. if so