Electronics Forum | Fri May 26 03:58:07 EDT 2006 | dave
Hi, We have a 5 zone oven and we use a RTS Profile. Our last zone is the zone that the reflow takes place. some basic analysis is as follows: TAL 70 secs, peak temp 210,ramp rate seems fine. A typical setting is : Z1 140 Z2 160 Z3 160 Z4 185 Z5 220
Electronics Forum | Wed Jul 05 11:37:38 EDT 2006 | dougs
I my last company i had to battle all the time for tooling to set up jobs, i asked the product engineering manager to include extra panels in the costs for NPI to be used as reflow profiling panels, he told me they had never needed these before and t
Electronics Forum | Fri Aug 25 09:12:07 EDT 2006 | russ
When not practical to drill hole into pcb to profile here is what I do and seems to be just fine. place thermo into area underneath BGA and let her rip, you will not be in the ball/solder joint, but the temp difference as long as you are in the arra
Electronics Forum | Thu Oct 19 20:03:04 EDT 2006 | darby
I agree with Stephen there! Or maybe we just didn't care enough about looking into it in the COLD profile days! Back to df: I don't think any manufacturer is going to give you a tolerance level, they'll stick with what they've told you -225. If it's
Electronics Forum | Thu Dec 21 10:27:24 EST 2006 | realchunks
>>> Now you must take into account your total board mass as well. If you have tons of heat sinks, or parts on the other side that can affect your profile, you should have them on the board when profiling. That�s where the "engineering" part in all
Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack
Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal
Electronics Forum | Mon Jan 15 11:21:48 EST 2007 | davef
Contractor mantra: * Profile is good * Boards are bad On profiles, the key question is: where did you take the profile? We�d guess cracked connections are giving the intermittent test results when pressing on the components. You use acoustic micro
Electronics Forum | Fri Jun 15 22:00:23 EDT 2007 | grantp
Hi, Thanks for the reply guys, and this is interesting information. I had assumed that if we had a paste spec, and this was the spec for the solder to reflow correctly, then if I achieved that spec, the solder should perform correctly. However this
Electronics Forum | Tue Oct 30 10:30:24 EDT 2007 | wayne123
how many layer board is it? what kinda temperatures is your oven currently hitting. In our reflow oven I have been using a profile that is the same for the top and bottom at zone 1 111C zone 2 at 164C zone 3 at 161C zone 4 at 208C and zone 5 at 2
Electronics Forum | Sat Nov 24 15:44:28 EST 2007 | mika
Hi DaveF, I had a short look into the Nr1. IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION Most interesting reading, but one thing though, I could not find any information about the oven profile. Just a picture of it. My question is of about the
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