Electronics Forum | Wed Dec 04 12:42:04 EST 2019 | dunks
We currently use Kester's ep256 as well and it seems to be a bit more grainy than one would expect from lead, especially if the temperature is too low. That paste says it's specialty is being robust over a wide range of profiles and stencil conditio
Electronics Forum | Wed Feb 12 14:38:18 EST 2020 | SMTA-Alex
There are several areas you can check. Your profile is very fast. You reach the peak at around 3 minute mark. That's not enough time for the fillet to form. Try to slow down your belt speed to around 90-95, to give it more time. Also, your temperatur
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Mon Jun 15 06:21:13 EDT 2020 | ameenullakhan
Hi Team, Main reason for HIP are; 1. Warpage in component or PCB : Verified the part and PCB 1.6 mm thickness no warpage found. 2. Hip was at different locations : center as well as corner : So not because of warpage of component. 3.Solder paste equ
Electronics Forum | Wed Oct 19 07:04:06 EDT 2022 | winston_one
If any changes in design is not possible and you have to solder it, it's a real headache, I know... I see only 3 options here that you can try consiquently: 1) Accurately profile the board and optimize a profile (go to lower limit of process windo
Electronics Forum | Wed Oct 19 18:47:28 EDT 2022 | winston_one
I can understand the situation, when there is now possibilitie to change board design, or something like this at the moment, and now you have to work with what you have now... Customers and management can bring a stupid situations... But I'm agree w
Electronics Forum | Fri Feb 16 09:01:05 EST 2024 | emanuel
I am confused about the parameters of the reflow profile needed to solder lead free components. We assemble boards for automotive modules required with leaded solder paste. The boards have ENIG finish. The problem is that I see some wetting issues, v
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Wed Feb 23 16:38:41 EST 2000 | Michael Parker
I have experienced tombstone with one brand of 0603 capacitor. Swapping in another brand (actually two different brands to date) has stopped the tombstone. I have measured the parts (length, width and height). There does not appear to be any apprecia
Electronics Forum | Thu Dec 21 08:45:40 EST 2000 | Hussman
I've been asked to "heat up the oven profiles" to "burn off" the excessive flux so our vision equipment can inspect solder joints. 1. I am using Multicore SN 63 no clean solder paste. 2. We use CR Technology Vision Inspection. Before I get too
