Electronics Forum | Thu Jul 10 10:25:05 EDT 2008 | gregoryyork
I guess the paste is Leaded hence the 220 Peak temp and the Sn100c is Eutectic at 227C so you need to be hotter to melt the HASL finish or you are relying on it alloying together with the paste which takes much longer. suggest running peak temp of 23
Electronics Forum | Mon Jul 07 11:46:29 EDT 2008 | aj
Hi All, Can anyone advise the spec for land size of a lead 0.2mm in width? I am placing a TQFP128 0.4mm pitch, the leads seem to be wider than the actual pads they are been placed on? I am also experiencing poor wetting on this part , it has NiPdAU
Electronics Forum | Thu Jul 24 21:20:58 EDT 2008 | srt
Hi, Now we also facing voiding issue after rework .But this only happen to 1 BGA from diffrent PCBA.We also already change 3 type solder paste and fine tune the profile follow solder paste spec but problem intermitten happen again.Pls help to advic
Electronics Forum | Mon Jul 28 14:30:22 EDT 2008 | grics
Take a look at this. Remember, these are only guidlines and can not replace any paste specs. As Real Chunks said, a profiler will be of HUGE help. We use this to determine what our top side temps are and to see if we have any problems with heat sen
Electronics Forum | Mon Aug 04 12:29:12 EDT 2008 | realchunks
If you are getting top side wetting, I doubt if this is a Delta-T problem. It also could be there is a lot of flux on the top side of the board stuck between the connector and the board. This is easily checked by fluxing and not running th eZ axi
Electronics Forum | Mon Aug 04 16:28:49 EDT 2008 | grics
Hey Patrick, thanks. The area that is dark (half circle) is where the camera was. It is the same color as the above. But you may be correct still. I also noticed that the majority of the solder balls were along the "Dark" blue depression around the
Electronics Forum | Tue Aug 12 13:40:08 EDT 2008 | ck_the_flip
GR@ICS: Are you drag soldering or point-to-point soldering? Keep in mind. Drag soldering mimics wave soldering. Molten solder is contacting and dragging across the solder mask. Keep in mind, too, that "semi-matt" or "semi-gloss" will also tend to
Electronics Forum | Thu Aug 07 11:58:36 EDT 2008 | pbarton
We have experienced the same problem with Pd/AG and P/Ag terminations on precision resistive parts. The problem is dissolution of the termination metallisation into the bulk solder. This is exacerbated by the higher thermal profiles required for RoHS
Electronics Forum | Wed Aug 27 08:46:14 EDT 2008 | vladig
Hi Sean, It's an old problem with no definitive cure for now. However, there are a couple of things to look for. First of all the location(s) of HoP. If it was due to the componetn warpage, then it would be most probably in the middle and it should
Electronics Forum | Thu Aug 28 18:48:49 EDT 2008 | markhoch
You're using a SAC305 chemistry? Double check your liquidus temp! Your profile shows a liquidus temp of 217 degrees C. SAC305 is not eutectic. (It doesn't transition from paste to liquid instantly). It goes thru a "pasty" stage. We use a temp of 221
